
Adhesives·Conductives·Encapsulants
| Technical Data Sheet |
| DA-5193 |
| Die Attach Adhesive for LEDs |
Description | DA-5193is a high adhesion, electrically-conductive adhesive for attaching LEDs to metallic substrates. DA-5193exhibits a variety of rapid cure options, while providing room temperature stability. In addition, the DA-5193exhibits very low out-gassing upon cure, while providing low bleed-out on most metallic substrates. |
Advantages | a Rapid cure | a Low temperature cure | a Low volatiles | a Excellent conductivity |
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Typical Uncured Properties | Property | Test Method | Typical Value | Viscosity (HB-DV-III+ Spindle #51) | TP 125 0.5 rpm | 90,000 cP | Viscosity (HB-DV-III+ Spindle #51) | TP 125 5.0 rpm | 18,000 cP | Thix ratio | (0.5 rpm/5.0 rpm) | ~5.0 | Specific gravity | ASTM D 792 | 3.3 | Color | Visual | Silver | Pot life (25°C) | 25% increase in viscosity (closed container) | > 1 wk | Open time (25°C) | Thin film (screen, stencil, ect.) | 16 hrs | Shelf life (0°C) | | 3 months | Shelf life (-40°C) | | 12 months | Weight loss on cure | | <1.5% |
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Cure Schedule | Recommended cure schedules are based on differential scanning calorimetery (DSC) scans and measurement of critical physical properties for the material. Ramp times to the particular cure temperatures are not included. The user should ensure that the material is subjected to cure time and temperature in the table, below. Cure Temperature | Cure Time (Minutes) | 150°C | 30 | 175°C | 10 | 185°C | 5 |
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