2英寸蓝宝石切割片
2英寸蓝宝石研磨片
2英寸蓝宝石清洗封装片
单晶晶体质量指标：
蓝宝石晶体纯度≥99.996%
蓝宝石晶体内没有散射颗粒、气泡、无颜色、无包裹物、无多晶、无孪生等现象；蓝宝石晶体无小角晶，晶体定向精度小于0.1°
产品规格：
|
Epi-Ready Sapphire Wafer |
|
Diameter |
50.8±0.1mm |
|
Thickness |
430±10μm |
|
Orientation |
C-plane 0.2°to M-axis ± 0.1° |
|
C-plane 0°to A-axis ± 0.1° |
|
Orientation flat |
16.0±1mm |
|
Primary flat location |
A-axis ± 0.2° |
|
Front side surface |
Epi-Ready Polished |
|
Surface Roughness |
Ra＜0.2nm |
|
Back side surface |
0.8—1.2μ |
|
TTV |
＜10μ |
|
BOW |
＜10μ |
|
Package |
Clean Room，Nitrogen Atmosphere |
|
研 磨 片 |
|
Orientation |
C-plane 0.2°to M-axis ±0.1° |
|
C-plane 0°to A-axis ± 0.1° |
|
Diameter |
50.8 ± 0.1mm |
|
Thickness |
0.49 ± 0.05mm |
|
TTV |
15um |
|
Warp |
15um |
|
Primary Flat |
Length |
16.0±1.0mm |
|
|
Orientation |
A-plane±0.2° |
|
Visual appearance |
No cracks，pits，edge chipping |
|
|
|
|
|
|
切 割 片 |
|
Orientation |
C-plane 0.2°to M-axis ±0.1° |
|
C-plane 0°to A-axis ± 0.1° |
|
Diameter |
50.8± 0.1mm |
|
Thickness |
0.52 ± 0.03mm |
|
TTV |
20um |
|
Warp |
＜40um |
|
Primary Flat |
Length |
16.0±1.0mm |
|
|
Orientation |
A-plane±0.2° |
|
Visual appearance |
No cracks，pits，edge chipping |
* 定向角度可根据客户的不同需求进行定向加工。
