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HMDS烘箱
The application of Hexamethyldisilazane (HMDS) is the industry\'s most widely used solvent to promote adhesion
between photoresist and silicon. It may be applied in vapor, liquid or solution form to lower surface energy,
provide excellent surface coverage, andreduce under cutting and lifting of patterned photoresists.
The optimal conditions for vapor priming are achieved at 10 Torr and 125C to dehydrate substrates.HMDS promotes
adhesion by creating a bond between the resist and silicon. The silizanes bond to the silicon in the wafer while
the methyls bond with the photoresist. It is used with differing types of substrates including silicon dioxide
(thermal, SOG, LPCVD, PECVD), silicon, polysilicon, silicon nitride, metal silicides, aluminum and others. Vapor priming
allows for HMDS application in a monolayer and reduces the chance of contamination.
HMDS烘箱用途:
HMDS最常使用于作为无机和有机材料之间的偶合 增加晶圆和光阻之间的附着;增加玻璃基板和光阻间的附着;
HMDS OVEN功能:
烘（Dehydration Bake）是为了去除吸附在晶圆表面上的水气。经过去水烘烤的晶圆，涂上一层用来增加光阻和芯片表面附着能力的化合物。
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