有鉛無鉛系列錫球均有庫存，有意者可來電洽談
1. Scope
This specification covers the globular solder which does not contain lead,EcoSolder ball
S M705, used for wiring connection and so on, of electric and electronic parts.
2. Standard
2. 1 Chemical Composition (Test method: STM-9-1)
Composition and impurity are prescribed as following table.
Composition (mass%Provisional standard)
Sn Ag Cu
Remains 3.0 ± 0.2 0. 5 ± 0.2
Impurities (mass% or less)
Sb Bi Zn Fe Al As Cd Pb
0.05 0.03 0.001 0.02 0.001 0.03 0.002 0.06
2. 2 Melting Temperature and Specific Gravity. (Reference value)
Melting
Specific Gravity
Temperature range(℃)
Approx. 217~ 219 Approx. 7.4
Date of Establish / Revision Approval
Q.A.Dept. Manufacturing Dept.
2. 3 Appearance (Test Method: STM-1)
(1) The surface shall be smooth and glossy uniformly
(2) Extremely poor gloss and adhesion of foreign matters and dirt shall not be found.
(3) Significant scratches, Cracks, and tears shall not be found.
(4) Crush, missing(exceed 10% of diameter) ,burr, and twins shall not be found.
(5) Excessive surface oxidation(dark film) and mixed-in oxide shall not be found.
2. 4 Diameter and Tolerance
Refer to next page please.
3. Attachment
Inspection shall be carried out on each production lot in terms of the following items (1)
through (2) ,and the document in which result is mentioned shall be attached at the
time of delivery, when requested by your company.
(1) Chemical composition (Inspection Report)
(2) Dimension (SPARKLE BALL INSPECTION REPORT)
4. Packaging / Marking
4. 1 Packaging
(1) ESD container or glass container shall be used for container.
(2) Shall be packed so as not to be damaged during transportation.
