超低价供应焊机专用矽胶片贝格斯sip-pad 900s矽胶片13728762242，价格优惠，性能超强！
特点和好处
- 热阻抗0.61℃-in2/W(@50psi)
- 低紧固压力
- 光滑和高度适应的表面
- 电气绝缘性
Sil-Pad 900S系列导热绝缘材料设计用于高导热绝缘的应用。这些应用一般采取较低紧固压力的元件固定方式。
Sil-Pad 900S高度适应度的光滑表面，具有高的导热性，这个特征使得在低压力下界面的热阻减至最小。
低紧固压力的应用包括用簧片固定的分散半导体器件。簧片固定安装迅速但施加在半导体上的压力有限，Sil-Pad 900S的光滑表面将界面热阻减至最小，从而得到最大的热性能。
典型应用
电源、汽车电子、马达控制、功率半导体
TYPICAL PROPERTIES OF SIL-PAD 900S |
| PROPERTY IMPERIAL＆#118alue METRIC＆#118alue TEST METHOD |
| Color Pink Pink Visual |
Reinforcement Carrier Fiberglass Fiberglass ─ |
Thickness(inch)/(mm) 0.009 0.229 ASTM D374 |
Hardness(Shore A) 92 92 ASTM D2240 |
Elongation(%45ºto Warp & Fill) 20 20 ASTM D412 |
Tensile Strength(psi)/(Mpa) 1300 9 ASTM D412 |
Continuous Use Temp(ºF)/(℃) -76 to 356 -60 to 180 ─ |
| ELECTRICAL |
| Dielectric Breakdown Voltage(Vac) 5500 5500 ASTM D149 |
| Type 3 Electrodes 8300 8300 ASTM D149 |
Dielectric Constant(1000Hz) 6.0 6.0 ASTM D150 |
Volume Resistivity(Ohm-meter) 1010 1010 ASTM D257 |
Flame Rating 94V-O 94V-O U.L |
| THERMAL |
Thermal Conductiviy(W/m-K) 1.6 a1.60.61 ASTM D5470 |
| THERMAL PERFORMANCE vs PRESSURE |
| Pressure(psi) 10 25 50 100 200 |
| TO-220 Thermal Performance(℃/W) 3.96 3.41 2.90 2.53 2.32 |
| Thermal Impedance(℃-in2/W) (1) 0.95 0.75 0.61 0.47 0.41 |
1）The ASTM5470(Bergquist modified)test fixture was used and the testsample was conditioned at 70℃prior to test.Therecorded ＆#118alue includes interfacial thermal resistance.These ＆#118alue are provided for referrnce omly.Actual application performance isdirectly related to the surface roughness.flatness an d pressure applied. |
可供规格：
片材、模切、卷材、带胶和不带胶
