Features

■ Surface Mount Devices

■ Lead free device

■ Surface Mount packaging for automated assembly

■ Agency recognition: UL

Applications

Almost anywhere there is a low voltage power supply, up to 60V and a load to be protected, including:

■ Computer mother board, Modem. USB hub

■ PDAs & Charger, Analog & digital line card

■ Digital cameras, Disk drivers, CD-ROMs,

SMD 2018 SERIES

ROHS&RICH 

FU YUAN

MODEL

MARKING

Vmax

Imax

Ihold

Itrip

Pd

Maximum

Time To Trip

Resistance

(Vdc)

(A)

@25°C

(A)

@25°C

(A)

Max.

(W)

Current

(A)

Time

(Sec)

Rimin

(?)

R1max

(?)

SMD2018-030

60

100

0.30

0.60

0.9

1.5

3.00

0.500

1.200

SMD2018-050

60

100

0.55

1.20

1.0

2.5

3.00

0.200

0.600

SMD2018-100

15

100

1.10

2.20

1.1

8.0

0.40

0.060

0.110

SMD2018-133

8

40

1.60

2.80

0.8

8.0

1.00

0.040

-

SMD2018-150

15

100

1.50

3.00

1.1

8.0

0.80

0.050

0.060

SMD2018-200

10

100

2.00

4.00

1.1

8.0

2.40

0.030

0.045

Ihold  = Hold Current. Maximum current device will not trip in 25°C still air.

Itrip   = Trip Current. Minimum current at which the device will always trip in 25°C still air.

Vmax= Maximum operating voltage device can withstand without damage at rated current (Imax).

Imax  = Maximum fault current device can withstand without damage at rated voltage (Vmax).

Pd    = Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Rimin/max= Minimum/Maximum device resistance prior to tripping at 25°C.

R1max = Maximum device resistance is measured one hour post reflow.

CAUTION :Operation beyond the specified ratings may result in damage and possible arcing and flame.

Environmental Specifications

Test

Conditions

Resistance change

Passive aging

+85°C, 1000 hrs.

±5% typical

Humidity aging

+85°C, 85% R.H. , 168 hours

±5% typical

Thermal shock

+85°C to -40°C, 20 times

±33% typical

Resistance to solvent

MIL-STD-202,Method 215

No change

Vibration

MIL-STD-202,Method 201

No change

Ambient operating conditions :         - 40 °C to 85 °C

Maximum surface temperature of the device in the tripped state is 125 °C

AGENCY APPROVALS :                                  U.L approved

Ihold versus temperature

MODEL

Maximum ambient operating temperature (Tmao) vs. hold current (Ihold)

-40°C

-20°C

0°C

25°C

40°C

50°C

60°C

70°C

85°C

SMD2018-030

0.48

0.42

0.35

0.30

0.24

0.21

0.17

0.15

0.10

SMD2018-050

0.87

0.77

0.67

0.55

0.46

0.41

0.36

0.31

0.23

SMD2018-100

1.71

1.52

1.32

1.10

0.94

0.84

0.74

0.64

0.50

SMD2018-150

2.38

2.10

1.82

1.50

1.27

1.13

0.99

0.85

0.64

SMD2018-200

2.95

2.65

2.35

2.00

1.74

1.59

1.44

1.29

1.06

Construction and Dimension (Unit:mm)

MODEL

A

B

C

D

E

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Min.

SMD2018-030

4.72

5.44

4.22

4.93

0.60

1.10

0.30

SMD2018-050

4.72

5.44

4.22

4.93

0.60

1.10

0.30

SMD2018-100

4.72

5.44

4.22

4.93

0.45

0.80

0.30

SMD2018-133

4.72

5.44

4.22

4.93

0.45

0.80

0.30

SMD2018-150

4.72

5.44

4.22

4.93

0.45

0.80

0.30

SMD2018-200

4.72

5.44

4.22

4.93

0.45

0.80

0.30

Termination pad characteristics

Terminal pad materials： Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper

Terminal pad solderability： Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.

Rework

Use standard industry practices, the removal device must be replaced with a fresh one.

Thermal derating curve

Typical time-to-trip at 25°C

!WARNING

· Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.

· PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated

fault conditions or prolonged trip events are anticipated.

· Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and

mechanical procedures for electronic components.

· Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.

· Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.

· Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the

devices. PPTC SMD can be cleaned by standard methods.

· Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or

reflow profile could negatively impact solderability performance of our devices.

?Recommended reflow methods：IR, vapor phase oven, hot air oven.

?Devices are not designed to be wave soldered to the bottom side

of the board.

?Recommended maximum paste thickness is 0.25 mm (0.010 inch).

?Devices can be cleaned using standard method and solvents.

Note：If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

Tape and reel specifications (mm)

Governing Specifications     EIA 481-2

W

12 ± 0.3

P0

4.0 ± 0.10

P1

8.0 ± 0.10

P2

2.0 ± 0.05

A0

4.4 ± 0.10

B0

5.5 ± 0.10

B1max.

8.2

D0

1.5 + 0.1, -0

F

5.5 ± 0.05

E1

1.75 ± 0.10

E2min.

10.25

T

0.6

T1max.

0.1

K0

1.36±0.1

Leadermin.

390

Trailermin.

160

Reel Dimensions

A max.

178

N min.

50

W1

12.4 ± 0.5

? Storage conditions：40°C max, 70% R.H.

? Devices may not meet specified performanc if storage conditions are exceeded.

Order information Packaging

SMD2018 050   SMD：surface mount device  Current 0.50A Tape & Reel Quantity  1500/2500 pcs/reel