| Standard Specification | | Growth method | LEC | | Diameter ( mm ) | 50.8 | | Thickness ( um ) | 500 +/-25 um | | Conductivity | Semi-conducting | | Orientation | <100> , <111> , <110> | | Off orientation | From 2° to 10° off | | Flat options | EJ or US SEMI. Std . | | Surface finish | One side or two sides polished | | EPD ( cm-2) | < 15000 or < 50000 | | Grade | Epi polished grade , mechanical grade | | Package method | Single wafer container with outer foil bag |
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