深圳市红日光电有限公司 SHENZHENHONGRIOPTOELECTRNICS CO.,LTD
COMMODITY:SURFACE MOUNT CHIP LED LAMP SPECIFICATION DEVICE NUMBER:HR-3528W1023-TRB: TAPPING & REELING, BLACK CAMRIER TAPE,ESD RESISTED. TAPPING AND PACKAGING SPECIFICATION(Ta=25℃)
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深圳市红日光电有限公司 SHENZHENHONGRIOPTOELECTRNICS CO.,LTD
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
§ Reflow soldering
Care must be taken not to cause to the Silicon gum resin portion if BRIGHTEK LEDs while it is exposedto high temperature. Care must be taken not rub the Silicon gum resin portion of BRIGHTEK LEDs with hard or sharp article such as the sand blast and the metal hook. |
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深圳市红日光电有限公司 SHENZHENHONGRIOPTOELECTRNICS CO.,LTD
Test items and results of reliability
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LED Usage and Handling Instructions
一、A、Manual soldering：
1、Soldering iron & tin wire
A soldering iron of 25-30W is recommended; the diameter of tin wire should be less than 0.5mm.
2、Temperature adjustment
To adjust the temperature from 280 to 350℃according to different PCB board
3、Soldering time
Please control the soldering time within 3-5 seconds. Do not apply any pressure to the epoxy encapsulation as well as the leads during the soldering process.
4、Soldering parameters according to different specifications
Parameters | SIDE VIEW | TOP3020 | TOP3528 | TOP5050 | HPR |
Soldering iron | 25-30W | 25-30W | 25-30W | 25-30W | 25-30W |
Temperature | 280-300℃ | 300-320℃ | 320-350℃ | 350℃ | 350℃ |
Soldering time | <3S | <3S | <5S | <5S | <5S |
B、Reflow soldering：
1、Soldering according to the following temperature chart is highly recommended
2、Soldering paste
Use soldering paste with the melting point at 230℃is recommended
二、Collet
1、Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the product’s quality. LED is different from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems
2、How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:.
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LED Usage and Handling Instructions 一、A、Manual soldering： 1、Soldering iron & tin wire A soldering iron of 25-30W is recommended; the diameter of tin wire should be less than 0.5mm. 2、Temperature adjustment To adjust the temperature from 280 to 350℃according to different PCB board 3、Soldering time Please control the soldering time within 3-5 seconds. Do not apply any pressure to the epoxy encapsulation as well as the leads during the soldering process. 4、Soldering parameters according to different specifications
B、Reflow soldering： 1、Soldering according to the following temperature chart is highly recommended
2、Soldering paste Use soldering paste with the melting point at 230℃is recommended 二、Collet 1、Abnormal situation caused by improper setting of collet To choose the right collet is the key issue in improving the product’s quality. LED is different from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2、How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:.
三、Other points for attention A、No pressure should be exerted to the epoxy shell of the SMD under high temperature. B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C、LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package.
四、This usage and handling instruction is only for your reference.
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三、Other points for attention
A、No pressure should be exerted to the epoxy shell of the SMD under high temperature.
B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break.
C、LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package.
四、This usage and handling instruction is only for your reference.
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