★Features
- 1. Emitted Color:White.
- 2. Mono-color type.top led.
- 3. Dimension:5.0x5.0x1.6 mm.
- 4. Suitable for all SMT assembly methods.
- 5. Compatible with automatic placement equipments.
- 6. This product doesn’t contain restriction Substance, comply RoHS standard.
★Application
- 1. Automotive: Dashboards, stop lamps, turn signals.
- 2. Mobile phones: LCD, keypad and symbol.
- 3. LCD backlighting.
- 4. Status indicators, consumer & industrial electronics.
- 5. General use.
★Outline Dimensions
NOTES:
- 1. All dimensions are in millimeters.
- 2. All tolerances are±0.1mm unless otherwise noted.
- 3. Electrodes: Au Plating.
★Absolute Maximum Ratings (Ta=25℃)
Parameter | Symbol | Rating | Unit |
Power Dissipation | Pd | 320 | mV |
Forward Current | IF | 60 | mA |
Peak Forward Current * | IFP | 100 | mA |
Reverse Voltage | VR | 5 | V |
Operating Temperature | Toper | -25~+80 | ℃ |
Storage Temperature | TSgt | -30~+80 | ℃ |
Soldering Temperature | Tsol | 260 (5sec) | ℃ |
* Condition for IFPin pulse of 1/10 duty and1msec width.
★Electrical andOpticalCharacteristics (Ta=25℃)
Parameter | Symbol | Condition | Min | Typ. | Max. | Unit |
Forward Voltage | Vf | IF=60mA | 3.0 | 3.2 | 3.6 | V |
Luminous Intensity | Iv | IF=60mA | 3600 | 4000 | - | mcd |
Reverse Current | IR | VR=5V | - | - |
| uF |
Peak Wave Length | P | IF=60mA |
|
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| nm |
Dominant Wavelength | d | IF=60mA |
|
|
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|
Chromaticity Coordinates | X | IF=60mA | 0.26 | 0.28 | 0.30 | - |
Y | IF=60mA | 0.24 | 0.27 | 0.30 | - | |
Viewing Angle | 2θ1/2 | IF=60mA | - | 120 | - | deg |
★Typical Electro-Optical Characteristics Curves
Directive Characteristics（Ta=25℃）
★Tapping andPackagingSpecifications (unit: mm)
Note:
- 1. Empty component pockets are sealed with top cover tape.
- 2. The maximum number of missing lamps is two.
- 3. The cathode is oriented towards the tape sprocket hole.
- 4. 1,000pieces/reel.
★Bin Limits
Intensity Bin Limits (@20mA):
BIN CODE | Min. (mcd) | Max. (mcd) |
H | 5.5 | 8.2 |
J | 8.2 | 12.3 |
K | 12.3 | 18.5 |
L | 18.5 | 28 |
Tolerance for each Bin limit is±15%
Color Bin Limit (@20mA):
BIN CODE | Min. (nm) | Max. (nm) |
3 | 460 | 465 |
4 | 465 | 470 |
5 | 470 | 475 |
6 | 475 | 480 |
Measurement Uncertainty of Luminous Intensity is ±10%
VF Bin Limits (@20mA):
BIN CODE | Min. (V) | Max. (V) |
D | 2.2 | 2.4 |
E | 2.4 | 2.6 |
F | 2.6 | 2.8 |
G | 2.8 | 3.0 |
Measurement Uncertainty of Forward Voltage is ±0.05V.
★BIN: x x x
Measurement Uncertainty of Color Coordinates is ±0.01.
★Reliability Test
Classification | Test Item | Reference Standard | Test Condition | Result |
Endurance Test | Operation Life | MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 | Connect with a power if=20mA Ta=Under room temperature Test time=1000,hrs |
0/20 |
High Temperature High Humidity Storage | MIL-STD-202:103B JIS-C-7021 :B-11 | Ta=+65℃±5℃ RH=90%-95% Test time=240hrs |
0/20 | |
High Temperature Storage | MIL-STD-883:1008 JIS-C-7021 :B-10 | High Ta=+85℃±5℃ Test time=1000hrs |
0/20 | |
Low Temperature Storage | JIS-C-7021 :B-12 | Low Ta=-35℃±5℃ Test time=1000hrs | 0/20 | |
Environment Test | Temperature Cycling | MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 | -35℃~+25℃~+85℃~+25℃ 60min 20min 60min 20min Test time=5cycle |
0/20 |
Thermal Shook | MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1011 | -35℃±5℃~ +85℃±5℃, 20min 20min est time=10cycle |
0/20 | |
Solder Resistance | MIL-STD-202:201A MIL-STD-750:2031 JIS-C-7021 :A-1 | Preheating: 140℃~160℃,within 2 minutes. Operation heating: 260℃(Max),within 10 secs(Max) |
0/20 |
★JudgmentCriteria of Failure for theReliability
Measuring items | Symbol | Measuring condition | Judgment criteria for failure |
Forward Voltage | VF(V) | IF=60mA | Over Ux1.2 |
Reverse current | IR (uA) | VR=5V | OverUx2 |
Luminous intensity | Iv (mcd) | IF=60mA | Belie Sx0.5 |
Note:
- 1. U means the upper limit of specified characteristics. S means initial value.
- 2. Measurement shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test.
★Soldering
Manualof Soldering
- 1. A soldering iron of 25-30W is recommended,the diameter of tin wire should be less than 0.5mm.
- 2. The temperature of the iron tip should not be higher than 350℃and Soldering within5seconds.
- 3. Do not apply any pressure to the epoxyencapsulation as well as the leads during the soldering process.
Reflow Soldering
- 1. Profile for Lead-free Solder Paste.
- 2. Profile for Lead Solder Paste.
★Handing
- 1. Care must be taken not to cause to the epoxy resin portion of LED while it is exposed to high temperature.
- 2. Care must be taken not rub the epoxy resin portion of LED with hard or sharp article such as the sand blast and metal hook.
★Notes forDesigning
- 1. Care must be taken to provide the current limiting resistor in the circuit so as to drive the LED within the rates figures.Also, caution should be taken not to be overload LED with instantaneous voltage at the turing ON and OFF of the circuit.
- 2. When using the pulse drive care must be taken to keep the average current within the rated figures. Also,the cirrent should be designed so as be subjected to reverse voltage when turning off the LED.
★Storage
- 1. In order to avoid the absorption of moisture,it is recommended to solder LED as soon as possible after unpacking the sealed envelope.
- 2. If the envelope is still packed, to store it in the environment as following:
1) Temperature:5~30℃,Humidity:RH 60% Max.
2) After this bag is opened,devices that will be applied to infrared reflow, vapor-phase reflow,or equivalent soldering process must be :
a) Completed within 168 hours.
b) Stored at less than 30% RH.
3) Devices require baking before mounting,if4aor 4b is not met.
4) If baking is required devices must be baked under below conditions: 48 hours at 60℃±3℃.
★Label of Products
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