◎ For surface mounted applications in order to optimize board space

◎ Low profile package

◎ Built-in strain relief

◎ Glass passivated junction

◎ Low inductance

◎ Excellent clamping capability

◎ Repetition Rate (duty cycle):0.01%

◎ Fast response time: typically less than 1.0ps from  0 Volts to V(BR) for unidirectional types

◎ Typical IR less than 1µA above 10V

◎ High Temperature solderting: 260°C/10 seconds  at terminals

◎ Plastic package has Underwriters Laboratory Flammability 94V-O

◎ Pb-free plated