Module No.

LGV57-NB23-V1.2

Module Size

65mm × 9mm × 10.7mm

Temperature (Operation)

-20°C to 70°C

Temperature (Stable Image)

0°C to 50°C

Assembly technique

SMT (ROSH)

Focus

Fix

Object distance

15CM-130CM

Resolution

600LW/PH (Center)

PCB printing ink

black

interface

USB 2.0

Power

USB bus power

Operating system request

Win 2000、Win XP、Win 7 or  Linux2.6.20以上版本

Package

Anti-electrostatic tray

Certifications

FCC and CE

Sensor Type

HM2050(1/5” )

Active Array Size

1600*1200 (4:3)

Sensitivity

1.1 V/(Lux·sec)

Pixel Size

1.75μm x 1.75 μm

Maximum Image Transfer Rate

30 fps for 720P; 18 fps for UXGA

S/N Ratio

37 dB

DynamicRange

65 dB

        Package

CSP-32pin

Lens Type

Lens Construction

2G2P+IR

F/No

2.0

EFL

0.95 mm

BFL(Optical)

2.12mm

FOV

130°

TV Distortion

<8.5%

Relative Illumination (Sensor)

50%

IR Filter

648±10nm

DSP Type

LGM23

        AGC/AEC/Whiter balance

Auto

Output Formats

 MJPG, YUV

Fixed Pattern Noise

< 0.03% of VPEAK-TO-PEAK

        Package

LQFN-46pin