BL-R8188EU1（EUS）
Product Specification
WLAN 11b/g/n USB MODULE
1. General Description
BL-R8188EU1 product is designed base on Realtek RTL8188EUS chipset .It combines CMOS MAC, Baseband PHY and RF in a single chip for IEEE 802.11/b/g/n compatible. It supports IEEE802.11i safety protocol, along with IEEE 802.11e standard service quality. It supports the new data encryption on 64/128 bit WEP and safety mechanism on WPA-PSK/WPA2-PSK, WPA/WPA2. It can implement the wireless network function on the laptop/desktop/MID and other wireless devices easily . This module has implemented some efficient mechanisms in its software and hardware to maximize the performance.
2. The range of applying
MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP and other device which need be supported by wireless networking.
3. Product Specification
3.1 Function Block diagram
3.2 Electrical and Performance Specification
|
Item |
Description |
|
Product Name |
BL-R8188EU1 |
|
Major Chipset |
RTL8188EUS |
|
Host Interface |
USB2.0 |
|
Standard |
IEEE 802.11b, IEEE 802.11g,IEEE 802.11n, |
|
Frequency Range |
2.4GHz~2.4835GHz |
|
Modulation Type |
802.11b: CCK, DQPSK, DBPSK 802.11g: 64-QAM,16-QAM, QPSK, BPSK 802.11n: 64-QAM,16-QAM, QPSK, BPSK |
|
Working Mode |
Infrastructure, Ad-Hoc |
|
Data Transfer Rate |
1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 and maximum of 150Mbps |
|
Spread Spectrum |
IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum) IEEE 802.11g/n:OFDM (Orthogonal Frequency Division Multiplexing) |
|
Sensitivity @PER |
1M: -90dBm@8%PER 6M: -88dBm@10%PER 11M:-86dBm@8%PER 54M:-73dBm@10%PER 135M:-68dBm@8%PER |
|
RF Power（Typical） |
16dBm@11b, 14dBm@11g , 13dBm@11n, |
|
Antenna type |
Connect to the external antenna through the half hole |
|
The transmit distance |
Indoor 100M, Outdoor 300M, according the local environment |
|
Dimension(L*W*H) |
13.0 x 12.3 x 1.55mm (LxWxH) ;Tolerance: +-0.2mm |
|
Power supply |
3.3V +/-0.2V |
|
Power Consumption |
standby mode 140mA@3.3V , TX mode 245mA@3.3V |
|
Clock source |
40MHz |
|
Working Temperature |
0°C to +50°C |
|
Storage temperature |
-40°C ~ +85°C |
3.3 DC Characteristic
|
Terms |
Contents | |||||
|
Specification : IEEE802.11b | ||||||
|
Mode |
DSSS / CCK | |||||
|
Frequency |
2412 – 2484MHz | |||||
|
Data rate |
1, 2, 5.5, 11Mbps | |||||
|
DC Characteristics |
min |
Typ. |
max. |
unit | ||
|
TX mode |
257 |
263 |
271 |
mA | ||
|
Rx mode |
80 |
82 |
84 |
mA | ||
|
Sleep mode |
78 |
80 |
82 |
mA | ||
|
Specification : IEEE802.11g | ||||||
|
Mode |
OFDM | |||||
|
Frequency |
2412 - 2484MHz | |||||
|
Data rate |
6, 9, 12, 18, 24, 36, 48, 54Mbps | |||||
|
DC Characteristics |
min |
Typ. |
max. |
unit | ||
|
TX mode |
244 |
245 |
245 |
mA | ||
|
Rx mode |
88 |
89 |
89 |
mA | ||
|
Sleep mode |
78 |
80 |
82 |
mA | ||
|
Specification : IEEE802.11n | ||||||
|
Mode |
OFDM | |||||
|
Frequency |
2412 - 2484MHz | |||||
|
Data rate |
6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps | |||||
|
DC Characteristics |
min |
Typ. |
max. |
unit | ||
|
TX mode |
201 |
207 |
214 |
mA | ||
|
Rx mode |
90 |
93 |
94 |
mA | ||
|
Sleep mode |
78 |
80 |
82 |
mA | ||
3.4 RF Characteristic
|
Mode |
Rate(Mbps) |
Power(dBm) |
EVM(dB) |
Sensitivity(dBm) | ||||||
|
CH1 |
CH7 |
CH13 |
CH1 |
CH7 |
CH13 |
CH1 |
CH7 |
CH13 | ||
|
11b |
1 |
17.43 |
17.36 |
17.20 |
-28.27 |
-28.11 |
-27.86 |
-95 |
-94 |
-94 |
|
11 |
17.91 |
17.77 |
17.68 |
-23.42 |
-24.02 |
-24.21 |
-86 |
-86 |
-86 | |
|
11g |
6 |
15.39 |
15.22 |
15.33 |
-32.02 |
-31.43 |
-31.17 |
-90 |
-90 |
-90 |
|
54 |
14.79 |
14.81 |
15.11 |
-33.03 |
-32.63 |
-32.31 |
-74 |
-73 |
-73 | |
|
11n HT20 |
MCS0 |
15.02 |
15.12 |
15.33 |
-32.14 |
-31.66 |
-32.88 |
-90 |
-90 |
-90 |
|
MCS7 |
14.75 |
14.67 |
14.66 |
-32.40 |
-31.29 |
-31.60 |
-70 |
-70 |
-70 | |
|
Mode |
Rate(Mbps) |
Power(dBm) |
EVM(dB) |
Sensitivity(dBm) | ||||||
|
CH3 |
CH7 |
CH11 |
CH3 |
CH7 |
CH11 |
CH3 |
CH7 |
CH11 | ||
|
11n HT40 |
MCS0 |
15.52 |
15.53 |
15.33 |
-32.54 |
-31.47 |
-32.49 |
-88 |
-88 |
-88 |
|
MCS7 |
14.65 |
14.6 |
14.76 |
-32.51 |
-31.39 |
-31.92 |
-68 |
-68 |
-68 | |
3.5 Product Photo
TOP Bottom
3.6 Mechanical Specification
Module dimension: Typical (L x W x H): 13mmx12.3mmx1.55mm Tolerance : +/-0.2mm
3.7 Product Pin Definition
4. Supported platform
|
Operating System |
CPU Framework |
Driver |
|
WIN2000/XP/VISTA/WIN7 |
X86 Platform |
Enable |
|
LINUX2.4/2.6 |
ARM, MIPSII |
Enable |
|
WINCE5.0/6.0 |
ARM ,MIPSII |
Enable |
5. Peripheral Schematic Reference Design
6. Package Information
7. Typical Solder Reflow Profile
8. Precautions for use
1. Pls handle the module under ESD protection.
2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature
245℃.
3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours.
Baking condition: 125 degree C, 12 hours
Baking times: 1 time
4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.
