IR HEATING
The IR 3000 is the newest and most advanced component rework system available on the market. The IR 3000 is fully Area Array capable and can also remove or install most other SMT (and thru-hole components). Featuring a (patented) aperture system to control and precisely apply the heat to protect adjacent components. The IR 3000 features a 500 W long wave top heater and a 1000 W long wave bottom heater. The standard PC software is the most advanced available on any rework system. Custom developed PID algorithms control the heating to your exacting specifi cations and make profi ling easier than ever! Using a high quality, specially developed IR thermal sensor, the process is completely controlled using non contact measuring methods. For added verifi cation, the SODR-CAM is available to watch the entire refl ow process happen in real time.
The process begins by loading your component into an adjustable nest which is then picked up using a vacuum pick. The part is lifted to the proper height above the optics and is now ready to be aligned to the PCB. Theta, X and Y adjustments are available to align the components. Precision micrometers are employed for adjusting the alignment in the X and Y directions. The system comes with four different size vacuum picks to handle a wide range of components. If fl ux dipping is needed, the part can be automatically dipped in fl ux prior to being aligned.
The optical alignment system within the IR 3000 features a high resolution, color digital camera with PC controlled zoom, focus, autofocus,and lighting control. The system is robust and does not require routine calibration or maintenance. Standard and full screen viewing options are available as part of the software. The optics extend and retract from the system automatically. High power ultrawhite LEDs are used to provide lighting to the component and PCB below while eliminating shadows and distortion. The vacuum pick
can be set for each component so that when properly adjusted, the component is
placed with almost zero force.
Once the component is placed, the heating process begins.
The system is unique in that it uses PACE Exclusive, customdeveloped, software based, PID controllers to control user determined ramp rates by selecting the time and the end temperature for each phase. Up to 3 additional data series plus the control sensor input can be can be stored with the profi le or can be exported to a CSV fi le. The IR thermal sensor has a laser built in for easy alignment of the sensor to the part! The IR sensor is one of the most accurate available.
If additional accuracy or verifi cation is desired, a calibration method can be employed. As an option, a standard K type thermocouple input can by used in conjunction with a K-type thermocouple mounted to the PCB to control the process. If additional bottom side heat is needed for thermally massive or large PCBs, the bottom heater is adjustable up to 1.5”.
IR 3000E IR 3000 FROM PACE
IDEAL FOR POST ASSEMBLY REWORK, REPAIR AND LOW VOLUME PRODUCTION OPERATIONS
COMPONENT PICK-UP
? Each component is placed into an adjustable nest.
? The nest is placed into position above the optics assembly.
? The reflow head automatically picks up the component and moves it
to the proper focal position for alignment.
? High-flow vacuum pump holds component securely.
? Four component pick-up nozzles are available.
? Flux dipping and/or stenciling can be incorporated into the component pick-up procedure.
COMPONENT ALIGNMENT/PLACEMENT
? High resolution Vision Overlay System (VOS) with Sony color camera and dichroic prism.
? VOS does not require routine calibration, eliminating costly errors and operator frustration.
? Images are viewed through the PC in standard or full screen viewing modes.
? 72 X magnification, color camera with auto-focus and manual capability.
? The automatically controlled, retractable optics housing protects VOS from dirt and contamination.
? Independent lighting controls for component and PCB to maximize overlay contrast.
? Ultra white, high power LED based lighting for PCB and component eliminates shadow and has wide dispersion angles to adequately illuminate large components.
? Precision Z axis movement ensures placement accuracy.
? Component is placed on PCB with minimal controlled pressure.
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