陶瓷精细电路板是通过电化学工艺加工获得超精细电路，线宽线距大于等于3μm。作为传感器，声表面波滤波器，微波射频等电信号传输核心部件，广泛应用于移动通信、医疗检测、环境在线监测等重要领域。   

        加工精度线宽可达最小3 μm

        加工精度线距可达最小3 μm

        金属层厚度>1 μm

        耐温测试-50~150 ℃

        金属层镍，铜，金，镍-磷，金锡合金

        基体：氧化铝，氮化铝，玻璃，硅片，压电陶瓷，微波介电陶瓷，塑料薄膜。

        中山大学电子封装电化学实验室技术，加工精度线宽线距可50微米

        联系电话：15013319966

        Interdigital electrodes are the hyperfine circuits obtained by electrochemical processing, the line width and spacing are greater than or equal to 50μm. They are used as core components of sensors, surface acoustic wave filters, microwave RF and other electrical signal transmission devices. They are also widely used in mobile communications, medical testing, environmental monitoring and other important areas.

        Line width＞50 μm

        Line spacing ＞50 μm

        Metal layer thickness ＞1 μm

        Temperature resistance test: -20~150℃

        Metal layer: Ni, Cu, Au, Ni-P, Au-Sn

        Substrate: Aluminium Oxide, Aluminium Nitride, glass, silicon wafers, piezoelectric ceramics, microwave dielectric ceramics, plastic films.

        With techniques from Sun Yat-sen University Electronic Packaging Electrochemistry Lab, our processing accuracy(line width and spacing) can reach 50μm.