适用制程Applicable process | SMT锡膏印刷后，回流焊前及回流焊后 | SMT solder paste printing,
reflow reflow soldered
before and after |
|
检测方法Test method | 彩色图像学习、统计分析 .字符自动识别(OCR),颜色距离分析,IC桥接分析 ,黑白比重分析,亮度分析,相似度分析 | Color images learning,Statistical analysis,
Automatic character recognition (OCR),Color distance analysis,IC bridge analysis,Black and white and the hydrometer analysis,
Brightness analysis,Similarity analysis |
|
摄像系统Image pickup system | 彩色CCD智能数字相机 | Color CCD intelligent digital camera |
|
分辨率Resolution | 20μm，15μm，10μm | |
|
照明系统Illuminating system | 环形塔状高亮度三色LED照明 | （R.G.B)Circular tower shaped high brightness LED lighting three color（R.G.B) |
|
编程方法Programming method | 快速手动编程，CAD坐标自动搜索元件库导入 | Fast promgamming，
CAD coordinates auto search compoment library |
|
检查项目Inspection Items | 锡膏印刷：有，无，偏斜，少锡，多锡，短路，污染 | The printing: yes, no, skewed, little tin,
tin, and short circuit, pollution |
|
| 元件检查：缺件，偏移，歪斜，立碑，侧立，翻件，极性反，错件，破损，AI元件弯曲等。 | Components inspection: missing parts,
migration, skewed, made up, turn piece,
side against, wrong thing, polarity, damaged,AI component bends. |
|
| 焊点检查：锡多，锡少，连锡，锡珠，铜箔污染，波峰焊插件焊点检查 | Solder joint inspection:
tin much, tin tin tin, even less pollution,
ul bead, soldering plugin solder joints inspection |
|
最小元件测试Minimum component test | 01005chip,0.25pitchIC | |
|
SPC统计系统SPC statistical system | 记录测试数据进行统计分析，Excel输出格式查看生产品质情况 | Record test data of statistical analysis,
Excel output format check production quality |
|
条码系统Barcode system | 相机自动识别 | Camera automatically identify |
|
操作系统Operating system | Windows XP,Windows 7 | |
|
远程控制Remote control | 使用网络远程操作，简便快捷修改程序及排除故障 | Using the network remote operation,
simple and rapid modify the program and
trouble-shooting |
|
测试结果Test results | 通过22英寸液晶显示器显示NG具体位置 | 24 inch LCD display through
physical location. NG |
|
