3108is a one component, low temperature cure epoxy designed for giving excellent adhesion on a wide range of materials inconsiderably short time. Typical applications include Memorycards, CCD/CMOSAssemblies.Particularly suited where lowcuring temperatures are required for heat sensitivecomponents.

Typical Value

Chemical Type                                             Epoxy

Appearance                               White

Casson Viscosity@25 °C, Pa·s                               2～4

Yield Point, 25 °C, Pa                                      570

BrookfieldCone & Plate,

        Pot life @ 25 °C, day                                       14

Specific Gravity @ 25°C                                   1.6

             Mechanic properties                               Typical Value                Test Method

Linear Shrinkage,%                                          1.1                               ASTM D 792

Hardness@25°C,Shore D                                 85                                ASTM D2240

Tg, ºC                                                             40                               ASTM D 3418

Coefficient of Thermal Expansion,            60×10-6Pre Tg (alpha 1)

165×10-6Post Tg (alpha 2)       ASTM D 3386

              Water absorption,%

              168Hr@85°C×85%                                        2.8                               ASTM D 570

Elongation, %                                                        2.1                               ASTM D 638

Tensile Strength, MPa                                      38                                ASTM D 638

Tensile Modulus, MPa                                      3700                            ASTM D 638

Lap shear strength (cured for 30min@80°C), MPa                        

Aluminums, abraded, 25℃                       23

Epoxy glass, 25℃                                ≥9MPa

      Electrical Properties                                                           Cured by 60 minutes @ 80 °C

              Volume resistivity                                     2.8 X 1016                            ASTM D 257

              Surface resistivity                                     2.2 X 1016

              10KHz   @25 ºC                 K                          D                          ASTM D 150

                                                               5.8               0.01

K = Dielectric constant by ASTM D 150 

D = Dissipation factor by ASTM D 150

1.Please read and understand the Material Safety DataSheet(MSDS)before using this productsafely.

2.If frozen or refrigerated, allow 12～24 hours for the product to reach room temperature.

3.It is important to remove uncured adhesivebefore curing.See “Cleaning” below for removal of uncuredadhesive.Once cured,itmust be heat to upon 150°C to remove.

4.Largequantities of uncured adhesive may exotherm during the curecycle. Avoid quantities larger than50grams in mass. Largerquantities in a bondline are safe to cure.

Recommended Cure Schedule                         10～20min@80ºC

                                                                      30～45min@60ºC

Note:Cure time on your partwill depend upon factors such as part geometry, materials to bebonded, bondline thickness andefficiency of the oven. Cureschedule should be confirmed with actual production parts andequipment.

It isvery necessaryto remove excess adhesive from thework area and application equipment before it hardens. Manycommon solvents and cleaners are suitabletoremoveuncuredglue. Consultingwiththe relevant technical persontoconfirmsafe and proper use of solvents.

This product shall be ideally stored in cold, dry location in unopened containers at a temperature between -20~-10°C.Exposure to higher temperatures (greater than-10°C)or lower temperature(less than -20°C) should adversely affect product properties. If product need to store forlongperiods, itshould be avoided extended exposureinto warm conditions.

Shelf life information:6 months     (under 2~8°C)

                                          10 months     (under-20~-10°C)