Emerson & Cuming

a pision of National Starch and Chemical

Company

Applications Engineering Group

46 Manning Road

Billerica, Massachusetts 01821

Phone: 978-436-9700

Fax: 978-436-9701

品牌：美国乐泰Emerson & Cuming

型号：XE-1218

三星认证、指定型号，设计产品三星手机、摄像头模组及所有含有BGA芯片的产品

  XE 1218

          Fast Flow, Reworkable, Capillary Underfill

  Preliminary Technical Data

Material Properties

Color                                              Black

Viscosity @ R.T.                                    1,400 cps

Enthalpy, ΔH:                                       350 J/g

Storage Modulus @ 25°C (via DMA):                  325 MPa

Process Information

Flow time                                          5 seconds

(200 um gap, 80°C preheat temp, 1 cm flow)

Work life at 25ºC                                   7 days

Work life at 40ºC                                   24 hours

Cure schedule (time at temperature):

110 C                                        10 minutes

100 C                                        22 minutes

Shelf life:                                          6 months @ -20°C

Instructions for use:

XE 1218 flows under the area array device by capillary action. While it is not essential, the underfill area should be cleaned of contaminants and obstructions to optimize the speed and quality of the

underfill process.

Preheat assembly to between 80ºC. Dispense a bead of the underfill using a syringe fitted with a 21 gauge needle on one (line) or two sides (L-shape) of the device perimeter. Syringe tip heating is not needed, but can be used. Very large devices may require multiple beads of underfill, but for most no second or ‘fillet pass’ is required. Because of its low viscosity and outstanding wetting characteristics, XE 1218 is designed to ‘self-fillet’ the opposite sides of the device.

Rework Procedure:

If assembly is defective after cure, XE 1218 allows for the component to be easily reworked. The preferred method is with a non-contact rework machine which minimizes potential damage to the PCB and soldermask.

Remove the component from the substrate by using local application of heat onto the component. The recommended heat profile is an identical profile used during initial assembly. Once the solder has reached temperatures above it’s reflow temperatures, lift the device off by using a slight twisting motion.

The site then should be cleaned, removing any excess underfill and solder remaining on the PCB site. Again, a non-contact, vacuum method is preferred.

Total time required for component removal is about 5-7 minutes.