Item Serial Technical Data Item Serial Technical Data 1 Layers 2-20 layers 15 Aspect ratio  10:01 2 Base Material  FR4, CEM-1, Aluminium, High Tg Material, High Frequence Rogers 16 Thermal Shock 3x10Sec@288℃ 3 Max Board Size   18" x 24" 17 Warp and Twist <0.7% 4 Min Board Thickness 4layers:0.4mm, 6layers:0.8mm, 8layers:1.0mm ,  10layers:1.2mm 18 Electric Strength >1.3KV/mm 5 Min Line Width 0.1mm 19 Peel Strength 1.4N/mm 6 Min Line Space 0.1mm 20 Solder Mask Abrasion >6H 7 Min Hole Size 0.1mm 21 Flammability 94V-0 8 PTH Wall Thickness 0.02mm 22 Impedance Control ±5% 9 PTH dia tolerance ±0.05mm 23 Surface Finishing HASL (Tin-Lead Free),  ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. 10 NPTH hole dia tolerance ±0.03mm 24 Solder Mask  Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask 11 Hole Position Deviation ±0.05mm 25 Color of silk-screen White, Black, Yellow ect. 12 Outline Tolerance ±0.1mm 26 E-Testing 100% E-Testing (High Voltage Testing);  Flying Probe Testing  13 S/M Pitch 0.8mm 27 Thickness of Copper 0.5-4oz 14 Insulation Resistance 1E+12Ω(Normal) 28 MOQ No ​

Available specifications:

Base materials: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1,000mm
Hole diameter: 0.2mm (minimum)
Line width: 0.075mm (minimum)
Line spacing: 0.075mm (minimum)
SMT pitch: 30° (minimum)
Annular ring: 0.05mm (minimum)
Aspect ratio: 11:01
Surface/hole plating tolerance:
Hole tolerance (PTH): 0.25mm
Hole tolerance (NPTH): 0.15mm
SM tolerance (LPI): Dimension
Electrically test: supported
With RoHS Directive-compliant
Possibility of SMT device mounting: supported