951是一款无卤素、无松香有机助焊剂笔，专为传统和表面贴装电路板组件的返工而设计。极低的固体含量（2.0%）和活化剂系统的性质导致焊接后几乎没有残留在组件上。没有残留物干扰电气测试。
951具有改进的焊接性能，提高焊接速度与牢固度，以在返工操作期间大限度地减少焊接桥（短路）。
这种焊剂适用于汽车、计算机、电信和其他可靠性考虑非常重要的应用。
钎焊板的表面绝缘电阻高于典型有机水溶性焊剂的表面绝缘电阻。
951含有一种缓蚀剂，当裸铜表面暴露在潮湿环境中时，不会形成腐蚀产物。
951笔头为圆形纤维笔头，当按下笔头时，助焊剂会随着笔头流向焊接板，助焊剂的量与您按压笔头的力度，与移动笔头速度相关。可以根据您的焊点大小适当调节。
笔头直径约为：4.3mm
笔头露出长度约为:5-8mm
液体含量约：10ml
笔身长度（含笔帽）：14CM
笔身直径：15mm
单支重量：18g+/-1g
有效期：2年
使用后请盖紧笔帽，以防止有效物质挥发。
注意：此价格为单支价格，不是图中所示整盒或多支价格。
951 is a halogen-free, rosin free organic flux pen designed for rework of traditional and surface mount circuit board components. The very low solid content (2.0%) and the nature of the activator system result in little residue on the component after welding. No residue interferes with the electric-al test.
951 has improved welding performance, increased welding speed and firmness, and minimized welding bridge (short circuit) during rework operation.
This flux is suitable for automotive, computer, telecommunic-ations and other applic-ations where reliability considerations are important.
The surface insulation resistance of brazed plate is higher than that of typic-al organic water-soluble flux.
951 contains an inhibitor that does not form corrosion products when exposed to moisture on bare copper surfaces.
951 pen head is a round fiber pen head. When pressing the pen head, the flux will flow to the welding plate along with the pen head.
The pen head diameter is about 4.3mm
The exposed length of the pen head is about 5-8mm
Liquid content: 10ml
Validity: 2 years
Please cover the c-ap tightly after use to prevent effective substances from volatilizing.
Note: this price is a single price, not a whole box or multiple prices as shown in the figure.
===========================
186 Flux Pen®专为传统和表面贴装电路板组件的含铅和无铅返工而设计。
186根据MIL-F-14256，被QPL批准为RMA型。虽然助熔剂的能力接近于RA型焊剂，但钎焊后的残留物无腐蚀性和不导电性。
186已开发用于焊接困难组件的关键应用，但工艺要求规定使用RMA型焊剂。
186具有较高的热稳定性，用于焊接需要较高温度的多层组件。暴露在高温下不会降低残渣在正常清洗溶剂中的溶解度。焊剂残留物不会导致表面绝缘电阻退化。使用少的离子活化剂和残余物的非活性性质允许残余物留在电路板组件上用于许多应用。助焊剂残留物还具有防潮和抗真菌性。
186 Flux Pen® is specific-ally designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies.-
186 under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive.
186 has been developed for use in critic-al applic-ations where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux.
186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation c-aused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applic-ations. The flux residue is also moisture and fungus resistant.
