SMT 红胶，是单一组分常温储藏受热后迅速固化的环氧树脂胶粘剂，其容许低温
度固化，超高速微少量涂敷仍可保持没有拉丝、溢胶、塌陷的稳定形状，其“剪切稀化”粘度特性和低吸湿性，非常适合应用于常温孔版印刷的 SMT 工艺，胶点形状非常容易控制，储存稳定且具有优良的耐热冲击性能和电气性能，使用安全，完全符合环保要求。
典型用途：
在波峰焊前将表面贴装元件粘接在印刷电路板上，适合于孔版印刷（刮胶）等需要低吸湿性贴
片胶所场合，防止在固化的胶粘剂中形成孔隙。
HR-978系列的特性（ Specification of HR-978）
成份 Composition | 环氧树脂： Epoxy resin |
外观 Appearance | 红色糊状： Paste/red-colored |
比重 Specific gravity | 1.31 |
粘度 Viscosity at 25℃,5rpm | 350-550Pa·S |
摇变性指数 Thixotropy index | 6.8(1rpm/10rpm) |
接着强度 Adhesive Strength 2125C Mini-mold tr SOP·IC16P 1206 0805 0603 0402 | 44N(4.5kgf)0.2mgr twin 45N(4.6kgf)0.3mgr twin 92N(9.4kgf)0.8mgf single×2 2.5KG 2.0KG 1.8KG 1.3KG |
电气特性 Electric Property 体积阻抗系数 Volume resistance 绝缘阻 Insulation resistance 初期值 Initial value 处理后* After treating* 介电常数 Dielectric constant 介电正接Dielectric loss tangent | 3.6×1016Ω·cm JIS K6911 2×1014Ω JIS Z3197 1.2×1012Ω 3.12/1MHZ JIS K6911 0.012/1MHZ JIS K6911 |
保存条件 Preservation condition | 1-10℃ |
* 处理条件：85℃×85%RH×DC50V×1000hrs. 使用 JIS Z3197 梳型电极 II 型（G10）
Treating condition:85℃×85%RH×DC50V×1000hrs.
JIS Z3197 Measured at comb electrode model II (G10)
包装方式
包装方式 Package styles | 容量 Contents | 点胶机设备厂商 Applicable Dispenser Makers |
1．针筒装 | 30g/50g | For all |
2．圆柱筒 | 200g | For all |
3．圆柱筒 | 360g | For all |
特征
1. Much lower temperature curing is aimed at amd is practically possible. 2. Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots. 3. stable adhesive strength can be obtained with a variety of SMD. 4.Long-term preservation stability is expected. 5.High heat-resistivity and excellent electric properties are possessed. 6. Usable for screen printing. |
1. 容许低温度硬化。
2. 尽管超高速涂敷、微少量涂敷仍可保持没有拉丝，塌陷的稳定形状。
3. 对於各种表面粘着零件，可获得安定的接着强度。
4. 储存安定性优良。
5. 具有高度耐热性和优良的电气特性。
6．可用於网版印刷。 ． 容许低温度硬化。
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固化条件
Curing conditions l It is suggested that the best curing condition is that the surface temperature of PCB plate reaches 150 > 120S or 120 > 150S. l When the higher curing temperature and the longer curing time,the stronger adhesive strength can obtained.We would suggest you to search out an optimum curing condition,for the temperature exerterd on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs. | 固化条件 l 建议固化条件是PCB 板表面温度达到150℃＞120S 或 120℃＞150S最佳； l 固化时间越长，可获得更高的粘接强度，依PCB 板上装着元件材质、大小不同而实际附加于接着剂的温度会有所不同，因此请依据实际生产情况找出最适合的固化条件。
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硬化条件曲线图（Example:curing profile）
使用方法（How to use）
l Adhesive should be preserved in refrigerator(below 2-8℃)to keep on its quality.Before processing,the adhesive should be takenout from the refrigerator for de-freezing about 3-4 hours until it reaching the room temperature. l The bottom of printing screen should be cleaned timely for good printing shape. l Toluene or ethyl acetate is possible to use for cleaning up this adhesive.
| l 为使接着剂的特性发挥最大效果，请务必放置于冰箱（2-8℃）保存。使用前请务必提前 3-4小时从冰箱取出，待红胶恢复至室温后使用。 l 为获得良好印刷成形，请及时清洁钢网底部。 l 对红胶的洗涤可使用甲苯，醋酸乙酯。
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