DOWSIL TC-5515 LT Low Density Thermal Conductive Gap Filler
DOW TC-5515 LT Low Density Thermal Conductive Gap Filler
产品特点：
2.0 W/m·K silicone gap filler, two-part material curing at room temperature
固化后是一种柔软、可压缩的材料，用于散热电子设备、电动汽车模块或其他发热部件。
DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a soft and compressible material capable of dissipating the heat from a heat source (typically EV modules, printed circuit board) to a cold source (typically aluminum housing acting as a heat sink). This material has been specifically designed to provide reliable cooling performance in EV battery and control unit modules due to the stability of properties during typical environmental exposure simulating the entire operating life of such a module.
DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is supplied as a twopart liquid component kit. When the liquid components are thoroughly mixed 1:1 either by weight or volume, the mixture cures to a soft elastomer. Curing occurs without exothermal reaction at a constant rate regardless of sectional thickness or degree of confinement.
详情：
购买烦请联系：021-52718700
