JH5063晶圆垫片>>THE WAFER PAD
>>>晶圆垫又称为防静电蓄积纸、硅片纸、半导体晶圆盒内缓冲垫片，太阳能晶片缓冲垫片、半导体晶圆盒内垫片、PCB缓冲片、导电分隔片、黑色晶圆隔片、防静电晶圆隔片、导电晶圆隔片、圆形晶圆分隔片、晶圆方片，另外按其表面处理工艺又称为防静电黑色压纹晶圆垫、压纹晶圆方片等。

 The WAFER PAD A waf pad is also called an anti-static accumulation pap, a silicon wafer paper, a buffer pad in a semiconductor waf box, A solar wafer buffer pad, a semiconductor wafer box inner pad, a PCB buffer pad, a conductive spacer, a black wafer spacer, an anti-static wafer spacer, a conductive wafer spacer, a circular wafer spacer, a wafer square, and the surface treatment process thereof is also called an anti-static black embossed wafer pad, an embossed wafer square, and the like.

此产品是由永久性导电或防静电的膜材经过热压成纹、模切而成。膜面可以做成光面，也可以根据要求制作各种花纹。产品可以按照要求制作成任意的尺寸和形状，制成品尺寸稳定性优良，表观整洁不掉粉不发尘。凸起的花纹状晶圆垫不但可以有效的防止产品遭受静电的损害，还可以起到一定的缓冲作用。
   This product is made of permanent conductive or anti-static film through hot-pressing, die-cutting. Film surface can be made smooth, can also be made according to the requirements of a variety of patterns. The product can be made into any size and shape according to the requirements, and the finished product has excellent dimensional stability, clean appearance, no powder falling and no dust. Protruding patterned wafer pads can not only effectively prevent the product from electrostatic damage, but also play a certain role in cushioning.  

 此类产品广泛应用于芯片制造、封装等企业的TFT-LCD、太阳能电池片、晶圆、太阳能硅片多单晶硅片的包装。 

 Such products are widely used in chip manufacturing, packaging and other enterprises TFT-LCD, solar cell wafer, wafer, solar silicon wafer packaging of multi-monocrystalline silicon wafer.
主要技术参数如下The main technical parameters are as follows：

●表面电阻值Surface resistance value：103~1011Ω

●最小长宽公差Minimum Length and Width Tolerance：≤±0.5mm

●厚度Width：25-400μm

●静电泄放时间Electrostatic discharge time：<1.0sec

●更多参数信息请询问销售顾问或至官网下载

●For more parameter information, please ask the sales advisor or go to the official website to download.