Technical Data 4340

Effective June 2017

www.eaton.com/electronics

Packaging information - mm

Dimensions- mm

1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc

2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1

3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is

necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of

other heat generating components will affect the temperature rise. It is recommended the part

temperature not exceed 125°C under worst case operating conditions verified in the end

application.

4 Isat1: Peak current for approximately 20% rolloff at +25°C.

5 Isat2: Peak current for approximately 20% rolloff at +125°C.

6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss),

K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).

7 Part Number Definition: FP0805Rx-Rxx-R

• Rx is the DCR indicator

• FP0805 = Product code and size

• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant

Product Specifications

Part Number7

OCL1 ± 10% (nH) FLL2 Min. (nH) Irms

3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6

FP0805R1-R03-R 32

23

110

95

823.6

FP0805R1-R06-R 58

42

83

61

823.6

FP0805R1-R07-R 72

52

65

67

49

0.17 ± 17% 823.6

FP0805R1-R10-R 100

72

50

35

823.6

FP0805R1-R20-R 200

144

20

16

823.6