ITG Part Number
OCL 1
L @ Isat1 2
DCR 3
Isat1 4
Isat2 4
Isat3 4
Irms 5
(nH)
(nH)
(mΩ)
(A)
(A)
(A)
(A)
± 10%
Min.
± 10%
@25℃
@75℃
@100℃
@25℃
SLA3232A-60K
60.00
43.00
0.18
140.00
130.00
121.00
46.00
SLA3232A-70K
70.00
50.00
0.18
123.00
112.00
105.00
46.00
SLA3232A-90K
90.00
64.00
0.18
93.00
87.00
80.00
46.00
SLA3232A-100K
100.00
72.00
0.18
87.00
80.00
74.00
46.00
SLA3232A-120K
120.00
86.00
0.18
71.00
65.00
60.00
46.00
SLA3232A-150K
150.00
108.00
0.18
56.00
52.00
48.00
46.00
SLA3232A-180K
180.00
129.00
0.18
46.00
43.00
39.00
46.00
Part number5
OCL1
(nH) ±15%
FLL2
(nH) minimum
Irms 3
(A)
Isat14
(A)
Isat25
(A)
Isat36
(A)
DCR (mΩ)
@ +20 °C
±25%
K-factor7
FP0404R1-R022-R
22 ±20%
15
40
40
34
32
0.32 ± 15%
2351
FP0404R1-R065-R
65
44
40
24
22
20
0.32
2248
FP0404R1-R080-R
80
54
40
19.5
18
16
0.32
2248
FP0404R1-R100-R
100
68
40
15.6
14
13
0.32
2248
FP0404R1-R110-R
110
74.5
40
14.2
13
11.8
0.32
2248
FP0404R1-R170-R
170
116
40
9.0
7.8
7.6
0.32
2248
Part Number7
OCL1
(nH)±10%
FLL2
(nH) minimum
I rms 3
(amps)
I sat14
(amps)
I sat25
(amps)
DCR (mΩ)
@ 20°C ±5%
K-factor8
R1 version
FP1007R1-R12-R
120
86
60
81
65
0.29 ± 10%
371
FP1007R1-R14-R
140
100
60
72
56
0.29 ± 10%
371
FP1007R1-R17-R
170
122
60
58
46
0.29 ± 10%
371
FP1007R1-R22-R
215
155
60
50
36
0.29 ± 10%
371
FP1007R1-R30-R
300
216
60
32
26
0.29 ± 10%
371
R2 version
FP1007R2-R12-R
120
86
51
81
65
0.48 ± 8%
368
FP1007R2-R14-R
140
100
51
72
56
0.48 ± 8%
368
FP1007R2-R17-R
170
122
51
58
46
0.48 ± 8%
368
FP1007R2-R22-R
215
155
51
50
36
0.48 ± 8%
368
FP1007R2-R30-R
300
216
51
32
26
0.48 ± 8%
368
R3 version
FP1007R3-R12-R
115
83
61
94
86
0.29 ± 5%
354
FP1007R3-R15-R
150
108
61
76
70
0.29 ± 5%
354
FP1007R3-R17-R
175
126
61
66
60
0.29 ± 5%
354
FP1007R3-R22-R
215
155
61
50
43
0.29 ± 5%
354
FP1007R3-R23-R
230
165
61
48
40
0.29 ± 5%
354
FP1007R3-R27-R
270
194
61
40
34
0.29 ± 5%
354
FP1007R3-R30-R
300
216
61
35
30
0.29 ± 5%
354
59PR9873N
59PR9874N
59PR9875N
59PR9876N
59PR9872N
59PR9871N
59PR9870N
59P9873N
59P9874N
59P9875N
59P9876N
59P9872N
59P9871N
C
2. Electrical Characteristic of SL5032 Series: 3. Mechanical Dimension(Unit:mm):
DCR
Isat1
Isat2
Isat3
Irms A B C D E F G
(mΩ)
(A) (A) (A) (A) Max. Max. Max. Max. Nom. Nom. Nom.
8.0%,9.5% or
10%
@25℃ @45℃ @100℃ @25℃ 13.00 13.00 8.00 13.30 7.60 4.80 2.50
0.29 , 8.0% 71.00 68.00 66.00 47.00
0.41 , 9.5% 71.00 68.00 66.00 40.00
0.32 , 8.0% 71.00 68.00 66.00 45.00
0.18 , 10% 71.00 68.00 66.00 60.00
0.29 , 8.0% 61.00 60.00 55.00 47.00
0.41 , 9.5% 61.00 60.00 55.00 40.00
0.32 , 8.0% 61.00 60.00 55.00 45.00
0.18 , 10% 61.00 60.00 55.00 60.00
0.29 , 8.0% 54.00 51.00 45.00 47.00
0.41 , 9.5% 54.00 51.00 45.00 40.00
0.32 , 8.0% 54.00 51.00 45.00 45.00
0.18 , 10% 54.00 51.00 45.00 60.00
0.29 , 8.0% 35.00 34.00 30.00 47.00
0.41 , 9.5% 35.00 34.00 30.00 40.00
0.32 , 8.0% 35.00 34.00 30.00 45.00
0.18 , 10% 35.00 34.00 30.00 60.00
Note:
1>.Open Circuit Inductance (OCL) test condition:100KHz,0.1Vrms,0Adc ,at 25℃.
2>.Full Load Inductance (FLL) Test condition:100KHz,0.1Vrms ,Isat;(Ta=25℃).
3>.Isat1 ,Isat2 & Isat3 : DC current that will cause inductance to drop approximately by 20% ;(Ta=25℃).
4>. Irms: DC current for an approximate temperature rise of 40℃ without core loss,.Derating is necessary for AC currents. PCB
pad layout,trace thickness and width,air-flow and proximity of other heat generating components will affect the temperature rise.
It is recommended the part temperature not exceed 130°C under worst case operating conditions verified in the end application.
5>.The nominal DCR is measured from point "a" to point"b",as shown above on the mechanical drawing.
4. Inductance Characteristics (Inductance vs. Current):
SL5032D-R32KHF 0.32 , 10%
SL5032A-R44LHF 0.44 , 15%
SL5032C-R44LHF 0.44 , 15%
SL5032 Series
SL5032A-R21KHF 0.21 , 10%
SL5032A-R26KHF 0.26 , 10%
1. Features:
Part Number
0.21 , 10%
SL5032C-R32KHF
SL5032C-R21KHF 0.21 , 10%
SL5032C-R26KHF 0.26 , 10%
SL5032B-R21KHF
SL5032A-R32KHF 0.32 , 10%
SL5032B-R32KHF
Inductance
(uH)
10% or 15%
SL5032D-R26KHF 0.26 , 10%
0.32 , 10%
SL5032D-R44LHF
US 1 914 347 2474 ●Taiwan 886 972 022 388 ●Shenzhen 86 755 8418 6263 ●Shanghai 86 21 5424 5141 ●HK 852 9688 9767
0.44 , 15%
SL5032B-R44LHF
SL5032D-R21KHF 0.21 , 10%
0.26 , 10%
Technical Data 4340
Effective June 2017
www.eaton.com/electronics
Packaging information - mm
Dimensions- mm
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4 Isat1: Peak current for approximately 20% rolloff at +25°C.
5 Isat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP0805Rx-Rxx-R
• Rx is the DCR indicator
• FP0805 = Product code and size
• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant
Product Specifications
Part Number7
OCL1 ± 10% (nH) FLL2 Min. (nH) Irms
3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6
FP0805R1-R03-R 32
23
110
95
823.6
FP0805R1-R06-R 58
42
83
61
823.6
FP0805R1-R07-R 72
52
65
67
49
0.17 ± 17% 823.6
FP0805R1-R10-R 100
72
50
35
823.6
FP0805R1-R20-R 200
144
20
16
823.6
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