2. Electrical Characteristic of SL5032 Series: 3. Mechanical Dimension(Unit:mm):

DCR

Isat1

Isat2

Isat3

Irms A B C D E F G

(mΩ)

(A) (A) (A) (A) Max. Max. Max. Max. Nom. Nom. Nom.

8.0%,9.5% or

10%

@25℃ @45℃ @100℃ @25℃ 13.00 13.00 8.00 13.30 7.60 4.80 2.50

0.29 , 8.0% 71.00 68.00 66.00 47.00

0.41 , 9.5% 71.00 68.00 66.00 40.00

0.32 , 8.0% 71.00 68.00 66.00 45.00

0.18 , 10% 71.00 68.00 66.00 60.00

0.29 , 8.0% 61.00 60.00 55.00 47.00

0.41 , 9.5% 61.00 60.00 55.00 40.00

0.32 , 8.0% 61.00 60.00 55.00 45.00

0.18 , 10% 61.00 60.00 55.00 60.00

0.29 , 8.0% 54.00 51.00 45.00 47.00

0.41 , 9.5% 54.00 51.00 45.00 40.00

0.32 , 8.0% 54.00 51.00 45.00 45.00

0.18 , 10% 54.00 51.00 45.00 60.00

0.29 , 8.0% 35.00 34.00 30.00 47.00

0.41 , 9.5% 35.00 34.00 30.00 40.00

0.32 , 8.0% 35.00 34.00 30.00 45.00

0.18 , 10% 35.00 34.00 30.00 60.00

Note:

1>.Open Circuit Inductance (OCL) test condition:100KHz,0.1Vrms,0Adc ,at 25℃.

2>.Full Load Inductance (FLL) Test condition:100KHz,0.1Vrms ,Isat;(Ta=25℃).

3>.Isat1 ,Isat2 & Isat3 : DC current that will cause inductance to drop approximately by 20% ;(Ta=25℃).

4>. Irms: DC current for an approximate temperature rise of 40℃ without core loss,.Derating is necessary for AC currents. PCB

pad layout,trace thickness and width,air-flow and proximity of other heat generating components will affect the temperature rise.

It is recommended the part temperature not exceed 130°C under worst case operating conditions verified in the end application.

5>.The nominal DCR is measured from point "a" to point"b",as shown above on the mechanical drawing.

4. Inductance Characteristics (Inductance vs. Current):

SL5032D-R32KHF 0.32 , 10%

SL5032A-R44LHF 0.44 , 15%

SL5032C-R44LHF 0.44 , 15%

SL5032 Series

SL5032A-R21KHF 0.21 , 10%

SL5032A-R26KHF 0.26 , 10%

1. Features:

Part Number

0.21 , 10%

SL5032C-R32KHF

SL5032C-R21KHF 0.21 , 10%

SL5032C-R26KHF 0.26 , 10%

SL5032B-R21KHF

SL5032A-R32KHF 0.32 , 10%

SL5032B-R32KHF

Inductance

(uH)

10% or 15%

SL5032D-R26KHF 0.26 , 10%

0.32 , 10%

SL5032D-R44LHF

US 1 914 347 2474 ●Taiwan 886 972 022 388 ●Shenzhen 86 755 8418 6263 ●Shanghai 86 21 5424 5141 ●HK 852 9688 9767

0.44 , 15%

SL5032B-R44LHF

SL5032D-R21KHF 0.21 , 10%

0.26 , 10%

Technical Data 4340

Effective June 2017

www.eaton.com/electronics

Packaging information - mm

Dimensions- mm

1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc

2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1

3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is

necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of

other heat generating components will affect the temperature rise. It is recommended the part

temperature not exceed 125°C under worst case operating conditions verified in the end

application.

4 Isat1: Peak current for approximately 20% rolloff at +25°C.

5 Isat2: Peak current for approximately 20% rolloff at +125°C.

6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss),

K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).

7 Part Number Definition: FP0805Rx-Rxx-R

• Rx is the DCR indicator

• FP0805 = Product code and size

• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant

Product Specifications

Part Number7

OCL1 ± 10% (nH) FLL2 Min. (nH) Irms

3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6

FP0805R1-R03-R 32

23

110

95

823.6

FP0805R1-R06-R 58

42

83

61

823.6

FP0805R1-R07-R 72

52

65

67

49

0.17 ± 17% 823.6

FP0805R1-R10-R 100

72

50

35

823.6

FP0805R1-R20-R 200

144

20

16

823.6