The maximum ambient temperature shall not exceed
40℃. Storage temperature higher than 40℃ could
result in the deformation of packaging materials.
● The maximum relative humidity recommended for
storage is 65%. High humidity with high temperature
can accelerate the oxidation of the solder plating on
the termination and reduce the solderability of the
components.
● Sealed plastic bags with desiccant shall be used to
reduce the oxidation of the termination and shall only
be opened prior to use. The products shall not be
stored in areas where harmful gases containing sulfur