本产品适用于各种FPC,FFC, COF, TAB, HSC与LCD 的预、本压邦定。
Application:
The machine is used for bonding FPC, FFC, COF, TAB, HSC to various LCD panels.
●可单独对位预压 ●可预、本压一体
●Aligning and pre-bonding ●Pre-bonding and main bonding
工艺应用：
TAB FOB FOG
Technic Application: TAB FOB FOG
◆功能特点：
Key Feature:
■压头采用高精度长行程双缸保障缸，有效的解决了行程长短与精度及安全相矛盾的问题。
High precise long-length cylinder of bond head can solve the contradiction of cylinder distance, precision and safety.
■打破传统的摄像机悬挂式结构及螺杆轴承调节机构，采用两组三轴千分尺调节夹具精密对位调节。
Two groups three-axis micrometer adjust fixture and position accurately.
■高精度三轴千分尺调节机构组辅以CCD下对位监控成像，适应于各种高精度ITO成像对位。
High precision micrometer adjusting structure and CCD camera bottom alignment, applied to various high precision ITO imaging and position.
■设备骨架采用优质钢通焊制，并采用钣金包装。其设备牢固性及稳定性极强且外形美观。、
The equipment body is made of good quality steel and sheet metal. High firmness and stability, elegant appearance.
■设备温度控制系统采用日本山武数显温控器，并内置PID自整定功能模块。
Japanese Yamatake digital indicator, build-in PID self-tunning module.
