FOG双头恒温绑定设备
旭崇自动化设备有限公司
中国 深圳
产品属性
图文详情
品牌推荐
品牌/型号
旭崇
功率
1000（W）W
Double Head COG Bonding M/CCOG双头本压设备 设备用途：本产品适用于各种液晶（LCD glass)于驱动IC本压邦定。Application:The machine is used for bonding IC driver to various LCD glasses.工艺应用：STN
CSTN
TFTTechnic Application: STN
CSTN
TFT
功能特点：Fey Feature:
■SUNSOM压力系统双缸结构可消除压头自重，压力最小精度可达0.1kg.Double cylinders of SUNSOM pressure system can eliminate self-gravity of bond head, minimum pressure accuracy is 0.1kg.
■SUNSOM压头结构采用2组精密滑轨主定位，直线轴承辅助定位，适用于各种高精度产品本压接。Two sets precise slide rail of SUNSOM bond head position, linear bearing assist position, applied to various high precision product bonding.
■上下加温方式、4套控温系统，满足多元化产品本压要求。Top and bottom constant temperature heating and four temperature controlling system meet to persified product bonding.
■自动式卷皮及双位夹具固定式工作，精度及效率大大提高。Auto rolling and double fixtures fixed work greatly improve accuracy and efficiency.
■预热头采用中心凹面结构，选用进口超硬材质刀头，保证高品质的本压要求。Concave structure of pre-bonding head, imported high rigid bond head, ensure product bonding efficiency.Double Head COG Bonding M/CCOG双头本压设备 设备用途：本产品适用于各种液晶（LCD glass)于驱动IC本压邦定。Application:The machine is used for bonding IC driver to various LCD glasses.工艺应用：STN
CSTN
TFTTechnic Application: STN
CSTN
TFT
功能特点：Fey Feature:
■SUNSOM压力系统双缸结构可消除压头自重，压力最小精度可达0.1kg.Double cylinders of SUNSOM pressure system can eliminate self-gravity of bond head, minimum pressure accuracy is 0.1kg.
■SUNSOM压头结构采用2组精密滑轨主定位，直线轴承辅助定位，适用于各种高精度产品本压接。Two sets precise slide rail of SUNSOM bond head position, linear bearing assist position, applied to various high precision product bonding.
■上下加温方式、4套控温系统，满足多元化产品本压要求。Top and bottom constant temperature heating and four temperature controlling system meet to persified product bonding.
■自动式卷皮及双位夹具固定式工作，精度及效率大大提高。Auto rolling and double fixtures fixed work greatly improve accuracy and efficiency.
■预热头采用中心凹面结构，选用进口超硬材质刀头，保证高品质的本压要求。Concave structure of pre-bonding head, imported high rigid bond head, ensure product bonding efficiency.
CSTN
TFTTechnic Application: STN
CSTN
TFT
功能特点：Fey Feature:
■SUNSOM压力系统双缸结构可消除压头自重，压力最小精度可达0.1kg.Double cylinders of SUNSOM pressure system can eliminate self-gravity of bond head, minimum pressure accuracy is 0.1kg.
■SUNSOM压头结构采用2组精密滑轨主定位，直线轴承辅助定位，适用于各种高精度产品本压接。Two sets precise slide rail of SUNSOM bond head position, linear bearing assist position, applied to various high precision product bonding.
■上下加温方式、4套控温系统，满足多元化产品本压要求。Top and bottom constant temperature heating and four temperature controlling system meet to persified product bonding.
■自动式卷皮及双位夹具固定式工作，精度及效率大大提高。Auto rolling and double fixtures fixed work greatly improve accuracy and efficiency.
■预热头采用中心凹面结构，选用进口超硬材质刀头，保证高品质的本压要求。Concave structure of pre-bonding head, imported high rigid bond head, ensure product bonding efficiency.Double Head COG Bonding M/CCOG双头本压设备 设备用途：本产品适用于各种液晶（LCD glass)于驱动IC本压邦定。Application:The machine is used for bonding IC driver to various LCD glasses.工艺应用：STN
CSTN
TFTTechnic Application: STN
CSTN
TFT
功能特点：Fey Feature:
■SUNSOM压力系统双缸结构可消除压头自重，压力最小精度可达0.1kg.Double cylinders of SUNSOM pressure system can eliminate self-gravity of bond head, minimum pressure accuracy is 0.1kg.
■SUNSOM压头结构采用2组精密滑轨主定位，直线轴承辅助定位，适用于各种高精度产品本压接。Two sets precise slide rail of SUNSOM bond head position, linear bearing assist position, applied to various high precision product bonding.
■上下加温方式、4套控温系统，满足多元化产品本压要求。Top and bottom constant temperature heating and four temperature controlling system meet to persified product bonding.
■自动式卷皮及双位夹具固定式工作，精度及效率大大提高。Auto rolling and double fixtures fixed work greatly improve accuracy and efficiency.
■预热头采用中心凹面结构，选用进口超硬材质刀头，保证高品质的本压要求。Concave structure of pre-bonding head, imported high rigid bond head, ensure product bonding efficiency.
