PRODUCT DESCRIPTION
Hysol® EO1080 is a unique one component epoxy
encapsulant with excellent shelf stability and fast curing
capability at moderate temperature. It is intended for
applications requiring excellent handling properties. The cured
material survives severe thermal shock and offers continuous
service to 177°C (350°F). It is particularly suited for use on
transistors and similar semiconductors, can be used for
encapsulation of watch IC’s.
TYPICAL APPLICATIONS
Casting compound used on transistors. Also encapsulation of
watch IC’s.
PROPERTIES OF UNCURED MATERIAL
Color Black
Specific Gravity, (ITM9A) 1.56
Shelf Life @ 4°C (40°F), months 12
Typical Value
Viscosity @ 25°C, (77°F)
(ITM2A)
Brookfield RVF
Spindle 7, Speed 4, Cp 60,000
PHYSICAL PROPERTIES, CURED MATERIAL
Coefficient of Thermal Expansion, ppm/°C
(ITM65B)
α1 35
α2 125
Glass Transition, (Tg), °C 121
(ITM65B)
Density, (gm/cc) ASTM D792 1.59
Hardness, shore D, minimum 86
(ASTM D2240)
Thermal conductivity, (Estimate) .6 w/mK
Moisture Absorption %,(ASTM D570)
24 hours immersion @ 25°C 0.05
@50°C 0.16
Flexural strength, Mpa, ASTM D790 135
Flexural Modulus, GPa, ASTM D790 9.2
Handling
Gel Time @ 121°C, (250°F), minutes, 3.1
(ITM10N)
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
Cure Schedule
Fast Cure 20 minutes @ 150°C
Alternate Cure 1 ½ hours @ 140°C or
2 hours @ 110°C
Recommended to minimize shrinkage.
Hysol® EO1080 should not be used for casting masses larger
than 50 grams. Some variation listed values may occur;
customer should determine whether cure other than
recommended cure above will give satisfactory results. Mix
thoroughly each time it is used. Heating to 32°C to 43°C
(90°F-110°F) will lower viscosity and aid in mixing and pouring.
Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Loctite Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Loctite
Corporation’s products. Loctite Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from domination
of patents owned by others or as a license under any Loctite
Corporation patents that may cover such processes or
compositions. We recommend that each prospective user test
his proposed application before repetitive use, using this data
as a guide. This product may be covered by one or more
United States or foreign patents or patent applications