特点和好处
热抗阻0.33℃-in2/W(@50psi)
符合标准
的热转移
高热传导率
Sil-Pad 2000是一种高性能,高可靠性的导热绝缘体,设计用于军事,航空,商业应用。Sil-Pad 2000符合标准。
该产品由硅类弹性体和高导热填料复合而成,在填料/粘合剂类材料中具有最大的热性能和介电性能。该产品无硅油,具有形状适应性,能满足或超过高可靠性电子封装应用的要求。
典型应用
航空、军工、商业用途
TYPICAL PROPERTIES OF SIL-PAD 2000 | PROPERTY IMPERIAL&#118alue METRIC&#118alue TEST METHOD | Color White White Visual | Reinforcement Carrier Fiberglass Fiberglass ─ | Thickness(inch)/(mm) 0.010 0.254 ASTM D374 | Hardness(Shore A) 90 90 ASTM D2240 | Continuous Use Temp(ºF)/(℃) -76 to 392 -60 to 200 ─ | ELECTRICAL | Dielectric Breakdown Voltage(Vac) 4000 4000 ASTM D149 | Dielectric Constant(1000Hz) 4.0 4.0 ASTM D150 | Volume Resistivity(Ohm-meter) 1011 1011 ASTM D257 | Flame Rating 94V-O 94V-O U.L | THERMAL | Thermal Conductiviy(W/m-K) 3.5 3.5 ASTM D5470 | THERMAL PERFORMANCE vs PRESSURE | Pressure(psi) 10 25 50 100 200 | TO-220 Thermal Performance(℃/W) 2.61 2.32 2.02 1.65 1.37 | Thermal Impedance(℃-in2/W) (1) 0.57 0.43 0.33 0.25 0.20 | 1)The ASTM5470(Bergquist modified)test fixture was used and the testsample was conditioned at 70℃prior to test.Therecorded &#118alue includes interfacial thermal resistance.These &#118alue are provided for referrnce omly.Actual applicationperformance isdirectly related to the surface roughness.flatness an d pressure applied. |
可供规格:片材、模切、带胶和不带胶,多种厚度确保客户需求:(0.010",0.015",0.020")