半导体器件键合铜丝作为芯片与外部电路主要的连接材料，具有良好的力学性能、电学性能（101%IACS）和第二焊点稳定性，广泛替代键合金丝应用于微电子工业。
lYSC铜丝具有低的硬度（52～65HV），避免了球焊过程中对基板的损伤
l严格的制备工艺保证了YSC铜丝具有光洁的表面和稳定、良好的成球性能
l均匀的柱状晶组织保证了YSC铜丝具有良好的抗氧化性能
l精湛的复绕工艺保证了YSC铜丝放线的顺畅，避免了使用过程中的断线，提高了生产效率
lYSC超细铜丝（≤0.018mm）具有良好的力学性能、电学性能和稳定性，能够满足在IC方面的应用
copper bonding wire in semiconductor devices as a connection material between chip and the outside of the main circuit, with excellent mechanics Properties, electrical properties (101% IACS) and the second bonding-spot stability
lStrict guaranteeing Preparation about YSC single-crystal copper bonding wire with bright , clean surface, and stability performance into a ball
lUniform columnar crystal organizational guaranteed the YSC single-crystal copper bonding wire to had not been Oxidized
lSkilled volume Line guaranteed the YSC copper bonding wire Actinomycetes smooth, to avoid the line break in the course of the use, and also can increased productivity
lYSC ultra-fine single-crystal copper bonding wire (≤ 0.018 mm) had good mechanical properties, electrical properties and stability, to meet in the application for IC经过特殊工艺生产的YPC铜丝，在具有YSC铜丝优良特性的同时，可以满足在纯N2气体保护下的完美键合，能够在更大程度上替代键合金丝。
Copper wire of YPC be treated by the special process of, with the fine features as YSC, to meet the bonding under the protection only in the N2 gas, can greater extent replace the gold wire. 注：褐色为YPC键合铜丝性能指标 Note: brown for the performance of YPC copper bonding wire 键合铜丝（YSC）第二焊点广泛适应性 Wider 2nd bond process window of copper bonding wire (YSC)
键合铜丝（YSC）优秀的拉力 Higher pulling values of bonding (YSC)
键合铜丝YSC/YPC在键合中的优良特性 lYSC键合铜丝表面对氧化物的处理，保证了铜丝键合过程中良好的成球效果 lYSC键合铜丝特殊的原材料控制，保证了铜丝键合过程中第二焊点稳定性，避免了第二焊点焊接失效现象 lYSC键合铜丝同时具有高延伸率和高破断力，可以适用于低弧度、高密度的焊接，避免了塌丝、拉力不足等现象 lYSC键合铜丝短的热影响区（HAZ）保证了键合的可靠性 lYPC键合铜丝能够在纯N2气体保护下实现良好键合，避免了铜丝键合过程中H2对环境的污染 lYPC键合铜丝高可靠性、高稳定性的特点适用于大规模集成电路引线键合 Excellent properties of YSC copper wire in bonding: lThe surface oxide treatment of YSC copper wire bonding to ensure the process of bonding were effect lRaw materials special control to ensure the stability of the second spot in the copper wire bonding process, and avoid a second spot welding failure. lYSC copper with high elongation and break load at the same time, and can be applied to low-arc, high-density welding, to avoid the collapse of bonding wire lYSC copper had small heat-affected zone (HAZ) ,and ensured the reliability of the bonding. lYPC copper can be meet the perfect bond under the protection in the net N2gas, to avoid polluting environment in the bonding process caused by H2
半导体器件键合铜丝规格及其力学性能和电学性能
Mechanical and electrical properties of copper wire bonding on semiconductor devices
