1. Scope:
This specification applies to AlInGaP metal bonding 10 x 10mil yellow LED chip, BN-Y1010A-A3。
2. Materials:
2.1 P-pad:Au alloy。
2.2 N-pad:Au alloy。
3. Dimensions:
3.1 Chip size:255±25μm x 255±25μm。
3.2 N-pad:φ90±10μm, thickness 3.5±0.3μm。
3.3 Chip thickness:200μm±25μm。
4. Electro-optical characteristics and specification: (Tc=25°C)