Base material: FR4

Layer count: 18-Layer

Copper thickness: 1.0oz (0.5oz/1.5oz/2.0oz/2.5oz/3.0oz)

Board thickness: 2.4mm (0.6mm/0.8mm/1.0mm/1.2mm/1.6mm/2.0mm)

Solder mask: green (yellow/blue/black/red/white/peelable)

Silkscreen: white (black/yellow/blue/red/green)

Surface finishing/treatments: ENIG/immersion gold/(OSP /chemical gold/flash gold/hard gold/ immersion silver/immersion tin/HASL (lead-free))

Minimum line width: 0.075mm (3-mil) (0.003-inch)

Minimum line spacing: 0.075mm (3-mil) (0.003-inch)

Minimum hole size: 0.20mm (8-mil) (0.008-inch)

Size:540×240mm

Features:BGA,Blind/Buried Via,impedance control,Via-in-Pad

Application:telecommunication facilities

Package:vacuum-packed with dryer (inner package)

       Cardboard carton with straps (outside package)