CM-S800主要由高纯度胶态二氧化硅组成，特别适用于各种硅片的抛光。该产品具有良好的稳定性和分散性，去除率高、表面效果好、批次间差异小以及对工件无损伤等优点。
CM-S800 is a colloidal silica slurry developed especially for polishing all kinds of silicon wafer. It has the advantages of excellent particle stability, dispersal, high removal rate, good surface effects, small difference between the batches and damage-free polishing, etc.
型号Type  项目 Item | 精抛 | 粗抛 | Ultrapure |
SiO2含量Content of SiO2 (%) | 15±2 | 35±2 | 50±2 |
pH (20℃) | 10.0±0.5 | 12.0±0.5 | 10.0-11.0 |
比重 Specific gravity (20℃) | 1.09±0.02 | 1.23±0.02 | 1.37±0.02 |
粘度 Viscosity (20℃，cps) | ≤30 | ≤18 | ≤20 |
碱游离度 Free Alkalinity as Na2O% m/m | <0.2 | <0.3 | <0.2 |
平均粒径 Average Particle Size (nm) | 20-45 | 55-65 | 45-55 |
杀菌剂含量 Biocide Content (ppm) | <200 | <200 | <200 |
用途 Application | 精抛 final polishing | 粗抛 first polishing | 粗抛 first polishing |
包装 Package | 5kg, 25kg, 260kg, 1T |
符合RoHS标准 RoHS compliant |
