CM-S600主要由高纯度胶态二氧化硅组成，特别适用于各种蓝宝石材料的抛光，二氧化硅抛光液中颗粒大小的分布范围狭窄，产品储存温度范围大,具有的高稳定性、不腐蚀设备、粘度小、使用后容易清洗等优点。
CM-S600 is a colloidal silica slurry developed especially for polishing all kinds of sapphire materials, silica polishing liquid is narrow particle size distribution ，large range of product storage temperature, high stability, anti-corrosion equipment, low viscosity and easy to clean after used, etc.
型号Type  项目 Item | 40 | 80 | 100 | 双抛 |
SiO2含量Content of SiO2 (%) | 15±2 | 35±2 | 35±2 | 35±2 |
pH (20℃) | 11.0±0.5 | 12.0±0.5 | 12.0±0.5 | 12.0±0.5 |
比重 Specific gravity (20℃) | 1.09±0.02 | 1.23±0.02 | 1.23±0.02 | 1.23±0.02 |
粘度 Viscosity (20℃，cps) | ≤18 | ≤18 | ≤18 | ≤18 |
碱游离度 Free Alkalinity as Na2O% m/m | <0.2 | <0.2 | <0.2 | <0.2 |
平均粒径Average Particle Size (nm) | 20-30 | 34-52 | 50-70 | 50-70 |
杀菌剂含量 Biocide Content (ppm) | <200 | <200 | <200 | <200 |
用途 Application | 精抛 Final polishing | 粗抛 First polishing | 粗抛 First polishing | 双抛 Double polishing |
包装 Package | 5kg, 25kg, 260kg, 1T |
符合RoHS标准 RoHS compliant |
