CM-S700主要由高纯度胶态二氧化硅组成，特别适用于2-6寸GaAs晶片的抛光，具有稳定性和分散性良好，去除率高、表面粗糙度小以及对工件无损伤等优点。即使在稀释倍率很高的情况下使用，仍具有很好的抛光效率和使用寿命。
CM-S700 is a colloidal silica slurry developed especially for polishing 2-6 inches GaAs wafer, with excellent particle stability and dispersal, it possesses a high removal rate, good surface effects and damage-free polishing. Even when used at high dilutions, CM-S700 delivers excellent processing efficiency and long slurry life.
 型号Type
项目 Item | 精抛 | 粗抛 |
SiO2含量Content of SiO2 (%) | 15±2 | 35±2 |
pH (20℃) | 10.0±0.5 | 10.0±0.5 |
比重 Specific gravity (20℃) | 1.09±0.02 | 1.23±0.02 |
粘度 Viscosity (20℃，cps) | ≤30 | ≤18 |
碱游离度 Free Alkalinity as Na2O% m/m | <0.2 | <0.2 |
平均粒径 Average Particle Size (nm) | 15-25 | 40-50 |
杀菌剂含量 Biocide Content (ppm) | <200 | <200 |
用途 Application | 精抛 final polishing | 粗抛 first polishing |
包装 Package | 5kg, 25kg, 260kg, 1T |
符合RoHS标准 RoHS compliant |
