进口拨动开关|MMS-A-4-2N|6PIN.间距2.0
2P2T
MSS-A-4-2N拨动开关
ITEM项目 | TEST CONDISTION测试条件 | PERFORMANCE规格 | ||||
6. ELECTRONICAL PERFORMANCE电气性能 | ||||||
6.1 | CONTACT | Being measured at 1kHz small current | 30mΩ max. | |||
RESISTANCE | contact resistance meter. | |||||
接触阻抗 | 在1KHz小电流下测量 | 30毫欧以下 | ||||
6.2 | Measurements shall be made following | |||||
INSULATION | application of Dc 500 V potential | 100MΩ min | ||||
RESISTANCE | across terminals and across terminals | |||||
绝缘阻抗 | and frame for 1 minrte. | 100兆欧以上。 | ||||
在端子之间和端子与壳之间加DC 500V | ||||||
条件下,持续1分钟测量。 | ||||||
6.3 | AC 500V (50Hz or 60Hz) shall be | |||||
WITHSTAND | applied across terminals and acoss | There shall be no breakdown. | ||||
VOLTAGE | teminals and frame for one minrte | |||||
耐电压 | 在端子之间和端子与壳之间加AC 500V | 无击穿现象出现。 | ||||
(50Hz或60Hz)条件下,持续1分钟表测量。 | ||||||
7. MECHANICAL PERFORMANCE 机械性能 | ||||||
7.1 | OPERATING | MEASURE AT THE POINT 3mm FROM THE TIP | ||||
FORCE | OF THE ACTUATOP (KNOB) | 150gf±50gf | ||||
动作力 | 在距离推杆前端3mm作测定点。 | |||||
7.2 | A static force of 500gf being applied | There shall be no sign of | ||||
TERMINAL | in one direction on the tip of the | damage mechanically and | ||||
STRENGTH | terminal for 1 minute. | electrically. | ||||
端子强度 | 一个500克之静电负荷施加于端子顶部的一个 | 无任何迹象显示机械及 | ||||
方向持续1分钟。 | 电器性能之损坏。 | |||||
7.3 | A static 1oad of 1kgf being applied | The deformation shall not be | ||||
ACTUATOR | in one direction of actuator for one min. | extrene and the actuator shall | ||||
STRENGTH | 一个1公斤静负荷施加于推杆之一个方向持续 | machanically work normally. | ||||
推杆强度 | 1分钟。 | 推杆无变形,可以正常操作 | ||||
P.2 | ||||||
ITEM项目 | TEST CONDISTION测试条件 | PERFORMAENCE规格 | ||||
8.DURABILITY 耐久性 | ||||||
8.1 | The tip of the terminals shall be | A new uniform coating of solder | ||||
SOLDERING | dipped 2mm in the solder bath at a | shall cover a minimum of 75% | ||||
TEST | temperature of 230+5℃for 3sec. | of the surface being immersed | ||||
可焊性试验 | 端子顶部被浸入焊锡池2mm深,温度230+5℃ | 浸入的部分75%以上表面将 | ||||
时间3秒。 | 被锡覆盖。 | |||||
8.2 | Solder bath method: | |||||
Solder temperatute 260+5℃ | ||||||
Immersion time 3+0.5 sec | ||||||
Immersion depth up to the surface of | ||||||
the board | ||||||
Thickness of PCB 1.6mm. | ||||||
RESISTANCE | 焊炉焊的温度控制在260+5℃,过炉焊接的 | Without deformation of case | ||||
TO | 时间3+0.5秒,于(基板)厚度为1.6mm。 | or excessive looseness of | ||||
SOLDERING | teminals electrical characteristics | |||||
HEAT TEST | Soldering iron method : | shall be satisfied. | ||||
耐焊性试验 | Bit temperature 350+10℃ | 本体无变形,能满足于机械、 | ||||
Application time 3+0.5sec | 电器性能。 | |||||
However excessive pressure shall not be | ||||||
applied to the terminal. | ||||||
手焊接的时候温度需控制在350+10℃,时间为 | ||||||
3+0.5秒,但不能在排脚上施加异常压力。 | ||||||
8.3 | 10,000cycles of operation at a rate | (1) Contact resistance | ||||
of 15-18 cycles per minute with | 接触阻抗 | |||||
LIFI TEST | unloading | 150mΩmax.150毫欧以下 | ||||
寿命试验 | 无负载条件下,每分钟15-18次的速度 | (2) Operating force | ||||
操作10,000次。 | 动作力 | |||||
30% initial value | ||||||
变化范围初始值30% | ||||||
(3) ITEN项目--6.2 | ||||||
(4) ITEN项目--6.3 | ||||||
(5) ITEN项目--7.2 | ||||||
(6) ITEN项目--7.3 | ||||||
8.4 | 80+2℃for 96 hours,after test keep | (1) Contact resistance | ||||
HEAT TEST | in normal condition for 30 minutes. | 150mΩmax. | ||||
耐热试验 | 在80+2℃环境中放96小时,再放在正常环境中 | 接触电阻150毫欧以下 | ||||
分钟后进行测试。 | (2) Insulation resistance | |||||
8.5 | HUMIDITY | 40+2℃90-95%RH for 96 hrs.after test | 绝缘电阻 | |||
TEST | keep in mormal condition for 30 min. | 50MΩ min.50兆欧以上 | ||||
耐湿试验 | 在40+2℃90-95%RH环境中放96小时,瑞放在正 | (3) There shall be no sign of | ||||
常环境中,30分钟后进行测试 | damage mechaniclly and | |||||
8.6 | At -20+3℃for 96 hours,after test | clectrically | ||||
COLD TEST | kept in normal condition for 30 min. | 无任何迹象显示机械及 | ||||
耐冷试验 | 在-20+3℃环境中放96小时,再置于正常 | 电器性能之损坏。 | ||||
环境中,30分钟后进行测试。 | ||||||
P.3 | ||||||
8.7 | In FIG.for 5 cycles,after lest kept | |||||
in normal condition for 30 min . | ||||||
In FIG. For 5 cycles, after test kept | ||||||
in normal condition for 30 min . | ||||||
如图示之环境中,循环5次后,再置于正常环境 | ||||||
TEMPERATURE | 中,30分钟后进行测试。 | |||||
CYCLING | ||||||
TEST | Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap Bitmap
| |||||
温度交 | ||||||
变试验 | ||||||
-20℃ | One | cycie | ||||
Hours | ||||||