供应银胶3681 可媲美YIZ-9346ST84-1/8340
性能特点
银填充,无空洞,内应力低导电环氧树脂混合粘合剂
用途
用于高可靠性裸铜,银镀镍钯金引线框架封装应用
Bond3681 |
Product name 产品名称 | 银胶 3681 |
Comparable 媲美 | Taiwan YizTech 9346ST84-1/ABLEBOND 8340 |
Composition 组成 | Epoxy conductive Silver 环氧导电银 |
Viscosity(cps) 粘度 | 30000 |
Thixotropic Index 触变指数 | 4.5 |
Cure Type 固化方式 | Standard 标准 |
Cure Condition 固化条件 | 60 minutes @ 150℃ |
Features 特征 | Silver filling, no voids, internal stress low conductive epoxy resin mixed adhesive 银填充,无空洞,内应力低导电环氧树脂混合粘合剂 |
Application 应用 | For the high reliability of the bare copper, silver palladium nickel plated leadframe package application 用于高可靠性裸铜,银镀镍钯金引线框架封装应用 |