应用领域：IC/MEMS
设备特点：
◆Features
Available for 2” to 8” wafer. 12” available upon discussion.
Maximum 16 classification (sort to 16 different trays).
Frexible chip sorting such as ring to tray, ring to ring, tray to ring.
Your own tray can be installed. (available for special trays).
◆Option
Proved chip data (map option) can be used for sorting program.
Both sides of chip can be inspected.
Positioning can be fineadjustable on collet theta axis.
Chip turn-over.
Please ask for full-automation handling.