型号:BL-R7603U
IEEE 802.11b/g/n 2T2R USB WiFi Module
特性Features:
Ø 接收制式Reserving System
IEEE Std. 802.11b
IEEE Std. 802.11g
IEEE Std. 802.11n
Ø 芯片方案Chip Solution
MTK MT7603U
Ø 结构大小 Size
27.5mm x 15.2mm x 2.35mm
型号预览Model Overview:
型号 | 安装方式 | 支持标准 | 速率 | 频段 | 天线接口 | 备注 |
WIFI-6 (B) | SMT | IEEE 802.11b/g/n | 300Mbps | 2.4G |
| 3.3V供电 |
深圳必联电子有限公司
深圳地址: 深圳市龙华新区观澜福前路268号
无锡地址:无锡市新吴区纺城大道299号
电话: 13812023818/ 0510-68579697
传真: +86-075528029002
网址: http://www.b-link.net.cn
客户确认反馈 Feedback of customer’s Confirmation
经确认,我方承认该规格书 We accept the specification after Confirmed
| ||||
客户名称 Customer name | 客户签字 Customer signature | 确认日期 Confirmation Date | ||
|
|
| ||
请签字后将此页与首页按以下地址回传我公司,谢谢! Please feed back this paper and first paper after your signature by the address,thanks!
| ||||
| ||||
批准 Approved | 审核 Checked | 拟制 Designed | 产品 Product | 无线模块 WiFi Module |
|
|
| 型号 Model | BL-R7603U
|
|
|
| 日期 Date | 2017-2-10 |
更改记录Record of Modification
序号 No | 更改日期 Date of modification | 主要更改内容 Main content of modification | 更改原因 Reason of modification | 更改通知编号 Serial number of modification | 确认 Confirm |
A | 2017-2-10 | 首次承认 |
|
| 冯杰 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1. 简介: Brief description:
WIFI MODULE BL-R7603U is based on MTK MT7603U.complied with IEEE 802.11b/g/n standard from 2.4GHz.Supported for 300Mbps high speed wireless network connection.
无线模块BL-R7603U是基于MTK MT7603U开发,支持2.4GHz IEEE 802.11b/g/n 标准,支持300Mbps 高速无线网络连接。
2. 原理图: Block diagram:
3. 外型及安装尺寸: Package outline and Mounting:
Typical Dimension (W x L ): 15.2mmx 27.5mm x 2.35mm
PCB Thickness: 1mm
Comments: All dimension tolerance should reference +/-0.15mm
4. 引脚定义: Pin Definition:
Pin | Symbol | Description |
1 | NC | Not Connected |
2 | VCC | +3.3V DC Power supply input |
3 | USBN | USB Data DN |
4 | USBP | USB Data DP |
5,7,9,10,12 | GND | Connected to Ground |
6 | NC | Not Connected |
8 | ANT1 | Antenna 1 |
11 | ANT0 | Antenna 0 |
5. Product Picture
TOP BOTTOM
6. 一般要求:General Requirements:
No. | Feature | Description |
6-1 | Operation Voltage | 3.3V±10% |
6-2 | Current Consumption | 430mA at continuous transmit mode 280mA at receive mode w/o receiving packet |
6-3 | Operation Temperature | 0°Cto +40°C |
6-4 | USB | High Speed USB2.0 Interface |
6-5 | Storage Temperature | -15℃ to +45℃ |
7. 电气特性: Electrical Characteristics:
7-1 IEEE 802.11b Section:
Items | Contents | ||||
Specification | IEEE802.11b | ||||
Mode | DSSS / CCK | ||||
Channel | CH1 to CH13 | ||||
Data rate | 1, 2, 5.5, 11Mbps | ||||
TX Characteristics | Min. | Typ. | Max. | Unit | Remark |
1. Power Levels(Calibrated) |
|
|
|
|
|
1) 17dBm Target (For Each antenna port) | 15 | 17 | 19 | dBm |
|
2. Spectrum Mask @ 17dBm |
|
|
|
|
|
1) fc +/-11MHz to +/-22MHz | - | - | -30 | dBr |
|
2) fc > +/-22MHz | - | - | -50 | dBr |
|
3. Constellation Error(EVM) @ 17dBm |
|
|
|
|
|
1) 1Mbps | - | - | -10 | dB |
|
2) 2Mbps | - | - | -10 | dB |
|
3) 5.5Mbps | - | - | -10 | dB |
|
4) 11Mbps | - | -20 | -10 | dB |
|
4. Frequency Error | -25 | - | 25 | ppm |
|
RX Characteristics | Min. | Typ. | Max. | Unit |
|
5. Minimum Input Level Sensitivity(each chain) |
|
|
|
|
|
1) 1Mbps (FER ≦8%) | - | -83 | -76 | dBm |
|
2) 2Mbps (FER ≦8%) | - | -80 | -76 | dBm |
|
3) 5.5Mbps (FER ≦8%) | - | -79 | -76 | dBm |
|
4) 11Mbps (FER ≦8%) | - | -76 | -76 | dBm |
|
6. Maximum Input Level (FER ≦8%) | -10 | - | - | dBm |
|
7-2 IEEE 802.11g Section:
Items | Contents | ||||
Specification | IEEE802.11g | ||||
Mode | OFDM | ||||
Channel | CH1 to CH13 | ||||
Data rate | 6, 9, 12, 18, 24, 36, 48, 54Mbps | ||||
TX Characteristics | Min. | Typ. | Max. | Unit | Remark |
2. Power Levels |
|
|
|
|
|
1) 15dBm Target (For Each antenna port) | 13 | 15 | 17 | dBm |
|
3. Spectrum Mask @ 15dBm |
|
|
|
|
|
1) at fc +/-11MHz | - | - | -20 | dBr |
|
2) at fc +/-20MHz | - | - | -28 | dBr |
|
3) at fc > +/-30MHz | - | - | -40 | dBr |
|
4. Constellation Error(EVM) @ 15dBm |
|
|
|
|
|
1) 6Mbps | - | - | -5 | dB |
|
2) 9Mbps | - | - | -8 | dB |
|
3) 12Mbps | - | - | -10 | dB |
|
4) 18Mbps | - | - | -13 | dB |
|
5) 24Mbps | - | - | -16 | dB |
|
6) 36Mbps | - | - | -19 | dB |
|
7) 48Mbps | - | - | -22 | dB |
|
8) 54Mbps | - | -30 | -25 | dB |
|
5. Frequency Error | -10 | - | 10 | ppm |
|
RX Characteristics | Min. | Typ. | Max. | Unit |
|
6 Minimum Input Level Sensitivity(each chain) |
|
|
|
|
|
1) 6Mbps (PER ≦10%) | - | -85 | -80 | dBm |
|
2) 9Mbps (PER ≦10%) | - | -84 | -79 | dBm |
|
3) 12Mbps (PER ≦10%) | - | -82 | -77 | dBm |
|
4) 18Mbps (PER ≦10%) | - | -80 | -75 | dBm |
|
5) 24Mbps (PER ≦10%) | - | -77 | -72 | dBm |
|
6) 36Mbps (PER ≦10%) | - | -73 | -68 | dBm |
|
7) 48Mbps (PER ≦10%) | - | -69 | -64 | dBm |
|
8) 54Mbps (PER ≦10%) | - | -68 | -63 | dBm |
|
6. Maximum Input Level (PER ≦10%) | -20 | - | - | dBm |
|
7-3 IEEE 802.11n HT20 Section:
Items | Contents | ||||
Specification | IEEE802.11n HT20 @ 2.4GHz | ||||
Mode | OFDM | ||||
Channel | CH1 to CH13 | ||||
Data rate (MCS index) | MCS0/1/2/3/4/5/6/7/8/9/10/11/12/13/14/15 | ||||
TX Characteristics | Min. | Typ. | Max. | Unit | Remark |
1. Power Levels |
|
|
|
|
|
1) 15dBm Target (For Each antenna port) | 13 | 15 | 17 | dBm |
|
2. Spectrum Mask @ 13dBm |
|
|
|
|
|
1) at fc +/-11MHz | - | - | -20 | dBr |
|
2) at fc +/-20MHz | - | - | -28 | dBr |
|
3) at fc > +/-30MHz | - | - | -45 | dBr |
|
3. Constellation Error(EVM) @ 14dBm |
|
|
|
|
|
1) MCS0 | - | - | -5 | dB |
|
2) MCS1 | - | - | -10 | dB |
|
3) MCS2 | - | - | -13 | dB |
|
4) MCS3 | - | - | -16 | dB |
|
5) MCS4 | - | - | -19 | dB |
|
6) MCS5 | - | - | -22 | dB |
|
7) MCS6 | - | - | -25 | dB |
|
8) MCS7 | - | -30 | -28 | dB |
|
4. Frequency Error | -10 | - | 10 | ppm |
|
RX Characteristics | Min. | Typ. | Max. | Unit |
|
5. Minimum Input Level Sensitivity(each chain) |
|
|
|
|
|
1) MCS0 (PER ≦10%) | - | -85 | -82 | dBm |
|
2) MCS1 (PER ≦10%) | - | -84 | -79 | dBm |
|
3) MCS2 (PER ≦10%) | - | -82 | -77 | dBm |
|
4) MCS3 (PER ≦10%) | - | -80 | -74 | dBm |
|
5) MCS4 (PER ≦10%) | - | -76 | -70 | dBm |
|
6) MCS5 (PER ≦10%) | - | -72 | -66 | dBm |
|
7) MCS6 (PER ≦10%) | - | -70 | -65 | dBm |
|
8) MCS7 (PER ≦10%) | - | -69 | -64 | dBm |
|
6. Maximum Input Level (PER ≦10%) | -20 | - | - | dBm |
|
7-4 IEEE 802.11n HT40 Section:
Items | Contents | ||||
Specification | IEEE802.11n HT40 @ 2.4GHz | ||||
Mode | OFDM | ||||
Channel | CH3 to CH11 | ||||
Data rate (MCS index) | MCS0/1/2/3/4/5/6/7/8/9/10/11/12/13/14/15 | ||||
TX Characteristics | Min. | Typ. | Max. | Unit | Remark |
1. Power Levels (Calibrated) |
|
|
|
|
|
1) 15dBm Target (For Each antenna port) | 12 | 14 | 16 | dBm |
|
2. Spectrum Mask @ 13dBm |
|
|
|
|
|
1) at fc +/-21MHz | - | - | -20 | dBr |
|
2) at fc +/-40MHz | - | - | -28 | dBr |
|
3) at fc > +/-60MHz | - | - | -45 | dBr |
|
3. Constellation Error(EVM) @ 14dBm |
|
|
|
|
|
1) MCS0 | - | - | -5 | dB |
|
2) MCS1 | - | - | -10 | dB |
|
3) MCS2 | - | - | -13 | dB |
|
4) MCS3 | - | - | -16 | dB |
|
5) MCS4 | - | - | -19 | dB |
|
6) MCS5 | - | - | -22 | dB |
|
7) MCS6 | - | - | -25 | dB |
|
8) MCS7 | - | -30 | -28 | dB |
|
4. Frequency Error | -10 | - | 10 | ppm |
|
RX Characteristics | Min. | Typ. | Max. | Unit |
|
5. Minimum Input Level Sensitivity(each chain) |
|
|
|
|
|
1) MCS0 (PER ≦10%) |
| -85 | -79 | dBm |
|
2) MCS1 (PER ≦10%) |
| -82 | -76 | dBm |
|
3) MCS2 (PER ≦10%) |
| -79 | -74 | dBm |
|
4) MCS3 (PER ≦10%) |
| -77 | -71 | dBm |
|
5) MCS4 (PER ≦10%) |
| -72 | -67 | dBm |
|
6) MCS5 (PER ≦10%) |
| -69 | -63 | dBm |
|
7) MCS6 (PER ≦10%) |
| -68 | -62 | dBm |
|
8) MCS7 (PER ≦10%) | - | -66 | -61 | dBm |
|
6. Maximum Input Level(PER ≦10%) | -20 | - | - | dBm |
|
8. 软件要求:Software Requirements
The driver supports the following operating systems: Linux, Microsoft Windows XP, Vista and Win7.
驱动程序支持以下操作系统:Linux,微软Windows XP,Vista和win7。
Mfg. software tool version is package_UIv96_DLLv2.27_driverv48_Jv2.25 or later.
制造软件工具的版本是package_UIv96_DLLv2.27_driverv48_Jv2.25或后续版本。
9. 关键物料
序号 | 关键件名称 | 型号 | 规格/材料 | 生产者 | 备注 |
1 | 集成电路IC | MT7603U |
| MTK |
|
2 | PCB | JUI7.820.0171 | FR-4,2LAY | 普瑞森 骏 亚 顺 络 |
|
3 | 晶体振荡器 | SMD3225-40M | 40M | 晶威特 鸿 星 加 高 |
|
10. Mechanical, Environmental and Reliability Tests:
The module have been tested list as follows
Test Items | Test Conditions | Qty | Criteria Condition | |
4-1 | Drop test | The packed samples within 100Kg can be tested Drop height: Face Side: 800/600/450mm Edge line: 600/450/350mm Drop time: 1 each Face and edge. | 1xBox | After drop test, the outer box and inner box will not been broken by appearance visual inspection. |
4-2 | Vibration test | X-Y-Z direction, first Frequency changing from 10Hz to 30Hz to 10Hz ,amplitude 0.75mm, 5 times vibrations, then frequency Changing from 30Hz to 55 Hz to 30 Hz, amplitude 0.15mm, 5 time vibration. | 3 | After test, the Appearance, Power EVM and Frequency error shall be satisfied with the specification. |
4-3 | Impact test | Impact acceleration: 50m/sec2; Impact duration: 16ms; Impact times: 1000. | 3 | After test, the Appearance, Power EVM and Frequency error shall be satisfied with the specification. |
4-4 | Soldering ability test | Soldering temperature: 235±5℃ Soldering duration: 2±0.5S | 3 | 1. After soldering, the soldered area must be covered by a smooth bright solder layer, some deficiencies such as a small amount of the pinhole, not wetting are allowed, but the deficiencies can not be in the same place; 2. At least 90% of soldered area shall be covered continuously by the soldering material. |
4-5 | Humidity test
| Leave samples in 40±3℃, 93% RH @ 96 hours | 3 | Leave samples in standard test condition for 2 hours then test, the Appearance, Power, EVM and Frequency error functional parameter shall be satisfied with the test specification. |
4-6 | High temperature load life test | Thermostat cabinet temperature: 55±5℃ Applied voltage: 110% rated voltage Working duration: 200 hour (Supply Voltage Cycle 23h power on, 1h power off) | 60 | After test, leave samples in standard condition for 1 hour and test, Power, EVM and Frequency error shall be satisfied with the test specification. |
4-7 | High temperature load test | Temperature: 55±5℃ Samples work for 16 hours | 3 | After test, the Appearance, Power, EVM and Frequency error shall be Satisfied with the test specification. |
4-8 | Low temperature storage test | Leave the samples in -25±3℃@24 hours | 3 | Leave samples in standard test condition for 2 hours then test, the Appearance, Power, EVM and Frequency error shall be satisfied with the test specification. |
4-9 | Low temperature load test | Leave samples in -15±3℃@ 2 hours, samples’ function shall be normal, the let samples work for 1 hour | 3 | After test, leave the samples in standard condition and tested the Appearance, Power, EVM and Frequency error shall be satisfied with the test specification. |
4-10 | Temperature circle test | One cycle duration -10±3℃ @3H 40±3℃ @3H Total cycle: 10x | 3 | After test, leave the samples in standard condition and tested Power,EVM and Frequency error shall be qualified and all the characters shall be satisfied with the test specification. |
4-11 | Continuous TP test | Twice cycle duration -10±3℃@4H +60±3℃@4H, +25@2H@2H | 3 | During test, There will not been appeared signal disconnection or interruption between DUT and AP. |
4-12 | ESD | Discharge voltage: 2kV C: 150pF Discharge resistance:330Ω Positive10 times 1 time for each second | 3 | The products can recoverable smoothly after ESD test. |
11. 包装信息: Packaging Information:
12. Refelow Standard Condition
升 温 区:温度:<150℃,时间:60~90秒之间, 斜率控制在1~3℃/S之间。
预热恒温区:温度:150℃~200℃,时间:60-120秒之间,斜率在0.3-0.8之间。
回流焊接区:峰值温度235℃~250℃(建议峰值温度<245℃),时间30-70秒。
冷 却 区:温度:217℃~170℃,斜率在3~5℃/S之间。
焊料为锡银铜合金无铅焊料/ Sn&Ag&Cu Lead-free solder(SAC305)。
注意:产品可承受极限温度255度5秒,为保证产品质量,回流曲线应该在保证焊点质量时不损害PCB和元器件之间寻求平衡,并在以上曲线区间内进行为宜。