1. General Description
BL-M8821CS1 is a small size and low profile of WiFi+BT combo module with LGA (Land-Grid Array) footprint, board size is 12mm*12mm with module height of 2.35mm. It can beeasily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides GSPI/SDIO interface for WiFi to connect with host processor and high speed UART interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi data rate can go up to 433.3Mbps in theory by using 1stream 802.11a/b/g/n/ac MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2.
2.The range of applying
MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP, etc, the device which need be supported by wireless networking.
3.Product Specification
3.2 Electrical and Performance Specification
Item Description
Product Name BL-M8821CS1
Major Chipset RTL8821CS
Host Interface SDIO 1.1/ 2.0/ 3.0
Standard WiFi: IEEE802.11a, IEEE802.11b, IEEE802.11g, IEEE802.11n, IEEE802.11ac, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i
BT: BT V2.1 BR+EDR, BT V3.0+HS, BT V4.0 LE+ BR/EDR , BT V4.1, BT V4.2
Frequency Range 2.4GHz~2.4835GHz
Modulation Type Wifi：802.11b: CCK, DQPSK, DBPSK
802.11a,g: 64-QAM,16-QAM, QPSK, BPSK
802.11n: 64-QAM,16-QAM, QPSK, BPSK
802.11ac: 256-QAM,64-QAM,16-QAM, QPSK, BPSK
BT: 8DPSK, π /4 DQPSK, GFSK
Working Mode Infrastructure, Ad-Hoc
Data Transfer Rate Wifi：802.11b: 11, 5.5, 2, 1 Mbps
802.11a,g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps
802.11n: MCS 0 to 7 for HT20/HT40
802.11ac: MCS 0 to 9 for VHT80
BT: 1 Mbps for Basic Rate and LE Mode; 2,3 Mbps for Enhanced Data Rate
Spread Spectrum IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)
IEEE 802.11a,g,n,ac:OFDM (Orthogonal Frequency Division Multiplexing)
BT: FHSS(Frequency-Hopping Spread Spectrum)
Sensitivity @PER WiFi: 11ac: mcs9 VHT80: -58dBm@10%PER
135M:-68Bm@10%PER
54M:-75Bm@10%PER；
11M:-86dBm@10%PER；
6M: -90Bm@10%PER；
1M: -92dBm@10%PER;
BT: -89dBm@1Mbps, -85dBm@2Mbps, -83dBm@3Mbps；
RF Power(Typical) WiFi: 17dBm@11b, 14dBm@11g ,14dBm@11n,13dBm@11ac
BT: MAX +10dBm
Antenna type Connect to the external antenna through the half hole
The transmit distance WiFi: Indoor 100M, Outdoor 300M, according the local environment
BT: 10m MAX.
Dimension(L*W*H) 12.0*12.0*2.35mm (LxWxH) ，Tolerance: +-0.15mm
Power supply 3.3V +/-0.2V
Power Consumption standby mode 82mA@3.3V ,
TX mode 350mA@3.3V
Clock source 40MHz
Working Temperature -10°C to +65°C
Storage temperature -40°C to +85°C
3.3Power Supply DC Characteristics
Vcc=3.3V，Ta= 25 °C，unit: mA
Supply current Typ. Max
Standby (RF disabled) 82 89
802.11b 1Mbps 11Mbps
Supply current Typ. Max. Typ. Max.
TX mode 350 335 330 320
Rxmode 90 95 92 96
802.11g 6Mbps 54Mbps
Supply current Typ. Max. Typ. Max.
TX mode 250 235 120 110
Rxmode 90 94 95 98
802.11n HT20 MCS0 MCS7
Supply current Typ. Max. Typ. Max.
TX mode 240 230 115 105
Rxmode 90 94 98 99
802.11n HT40 MCS0 MCS7
Supply current Typ. Max. Typ. Max.
TX mode 235 225 110 100
Rxmode 90 95 98 99
802.11ac VHT80 MCS0 MCS9
Supply current Typ. Max. Typ. Max.
TX mode 166 155 115 105
Rxmode 90 95 98 99
3.4 RF Characteristic
TX Power 802.11b: 17±1.5dBm
802.11g/11n-HT20: 15±1.5dBm
802.11a/n -HT40: 14±1.5dBm
802.11ac –VHT80: 13±1.5dBm
TX Constellation Error(EVM) 802.11b: < -22dB@11Mbps
802.11g/11n-HT20: < -28dB@54Mbps
802.11n-HT40: < -28dB@150Mbps
802.11ac: < -32dB@MCS9
Receiver Minimum Input Sensitivity@PER 2.4G:
802.11b: <-92dBm@PER<8%@1Mbps
802.11b: <-86dBm@PER<8%@11Mbps
802.11g: < -72dBm@PER<10%@54Mbps
802.11n: < -68dBm@PER<10%@MCS7
5G:
802.11g: < -70dBm@PER<10%@54Mbps
802.11n: < -68dBm@PER<10%@MCS7
802.11ac: < -51dBm@PER<10%@MCS9
RFTest Report
Mode Rate(Mbps) Power(dBm) EVM(dB) Sensitivity(dBm)
CH1 CH7 CH13 CH1 CH7 CH13 CH1 CH7 CH13
11b 1 17.53 17.89 17.61 -25.20 -25.15 -24.53 -94 -94 -94
11 17.22 17.49 17.79 -23.62 -24.13 -23.71 -87 -87 -87
11g 6 15.25 15.14 15.44 -32.00 -33.78 -33.57 -92 -92 -92
54 15.80 15.28 15.35 -30.28 -31.10 -30.19 -75 -75 -75
11n
HT20 MCS0 15.38 15.29 15.41 -33.00 -32.09 -32.58 -90 -90 -90
MCS7 15.38 15.34 15.49 -32.35 -33.21 -33.54 -70 -70 -70
Mode Rate(Mbps) Power(dBm) EVM(dB) Sensitivity(dBm)
CH3 CH7 CH11 CH3 CH7 CH11 CH3 CH7 CH11
11n
HT40 MCS0 15.45 15.81 15.47 -33.24 -33.92 -33.54 -88 -88 -88
MCS7 15.14 15.56 15.17 -33.75 -34.08 -33.20 -68 -68 -68
Mode Rate(Mbps) CH38 CH102 CH159 CH38 CH102 CH159 CH38 CH102 CH159
11a
HT40 MCS0 16.51 16.73 16.54 -23.96 -22.65 -22.49 -89 -89 -89
MCS7 14.73 15.07 14.09 -31.04 -32.40 -30.43 -70 -70 -70
Mode Rate(Mbps) CH42 CH106 CH155 CH42 CH106 CH155 CH42 CH106 CH155
11ac
VHT80 MCS0 15.23 16.18 15.94 -25.68 -23.35 -23.31 -83 -83 -83
MCS9 14.50 14.36 14.07 -33.62 -34.37 -33.90 -58 -58 -58
3.6 Mechanical Specification
Tolerance: +-0.15mm
3.7 Product Pin Definition
Pin No： Function Description
1 GND Grond
2 WIFI/BT_ANT WIFI/BT_ANT
3 GND Grond
4,5 NC NC
6 BT_WAKE HOST wake-up Bluetooth device
7 BT_HOST_WAKE Bluetooth device to wake-up HOST
8 NC NC
9 VABT Battery LDO input,5.5V-2.8V
10,11 NC NC
12 WL_DSI# Shared with GPIO9 This Pin Can Externally Shutdown the RTL8821CS
WLAN function when WL_DIS# is Pulled Low. When this pin pulled low, SDIO interface will be disabled.
13 WL_HOST_WAKE WLAN to wake-up HOST
14 SD_D2 SDIO data line 2
15 SD_D3 SDIO data line 3
16 SD_CMD SDIO command line
17 SD_CLK SDIO CLK line
18 SD_D0 SDIO data line 0
19 SD_D1 SDIO data line 1
20 GND Grond
21 NC NC
22 VDD_IO supply voltage for SDIO IO/3.3V
23 NC NC
24 SUSCLK_IN Shared with EECS. External 32K or RTC clock input
25 PCM_DOUT PCM Data output
26 PCM_CLK PCM Clock
27 PCM_DIN PCM data input
28 PCM_SYNC PCM sync signal
29,30 NC NC
31 GND Grond
32 NC NC
33 GND Grond
34 BT_DIS# Shared with GPIO11 This Pin Can Externally Shutdown the RTL8821CS
WLAN function when BT_DIS#is Pulled Low. When this pin pulled low, UART interface will be also disabled.
35 NC NC
36 GND Grond
37,38,39,40 NC NC
41 UART_RTS UART_RTS
42 UART_OUT HOST Data output
43 UART_IN HOST Data input
44 UART_CTS UART_CTS
4. Supported platform
Operating System CPU Framework Driver
LINUX(kernel2.6.35~3.18.17) ARM, MIPSII Enable
5.Package Information
8. Precautions for use
1. Pls handle the module under ESD protection.
2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature
245℃.
3.Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours.
Baking condition: 125 degree C, 12 hours
Baking times: 1 time
4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.
