广州瀚吉传感科技有限公司拥有独立自主的商标品牌，而且被广东省认定为高新技术产品。2011年，三个毕业于哈尔滨工业大学电化学专业的博士，在广州市中山大学和惠州市大亚湾分别组建陶瓷薄膜电路及器件的研发和生产基地。研发基地为中山大学电子封装电化学实验室，生产基地为惠州市。2016年，根据市场陶瓷电路板磁控镀膜和叉指电极元器件的需求，在广州市中山大学科技园组建了广州瀚吉传感科技有限公司联合广州瀚吉传感科技有限公司子公司惠州力道电子材料工厂。从而实现研发，生产和销售三位一体的陶瓷电路板精细电路板柔性电路板磁控镀膜镀金和叉指电极元器件钰芯品牌服务团队。
Ceramic substrates, ceramic circuit boards, Aluminium Nitride substrates, Aluminium Oxide substrates processing, line width and spacing can reach 50μm.
Sun Yat-sen University Electronic Packaging Electrochemistry Lab, our processing techniques come from space technology.
定制加工联系电话：15013319966
To microelectronics companies, we adopt DPC technology to process ceramic circuits, meeting their demands for mass production of the ceramic circuits. To scientific research institutions, we provide the required chemicals for ceramic circuits processing. To researchers, we provide the services of magnetron sputtering, film and electroplating processing.
The following is a brief introduction to 2525 standard edition, with sample pictures:
Alumina purity is 96%, material plate thickness is 0.5mm, copper plating thickness is 65±15μm.
The color of solder-resist ink is optional, you can choose double-sided white or green. Immersion silver thickness is 0.2-0.4μm.
Plating layers on Side A
The first layer: material: Ti; Thickness: 0.1μm;
The second layer: material: Cu; Thickness: 65±10μm
The third layer: material: Ag; Thickness: 0.2-0.5μm
Plating layers on Side B
The first layer: material: Ti; Thickness: 0.1μm;
The second layer: material: Cu; Thickness: 65±10μm
The third layer: material: Ag; Thickness: 0.2-0.5μm
Solder-resist ink: white or green
Thickness of solder-resist ink on side A: 10-13μm
Thickness of solder-resist ink on side B: 10-20μm
Hole cut copper plating, apertures are 53μm, 100μm, 53μm
Size: 109.2mm*54.5mm/798pcs
