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热沉材料 Heat Sink

    功率电子器件和电路在运行时会产生大量的热。热沉材料有助于消除芯片热量,将其传输到其他介质,维持芯片稳定工作。

    钼铜、钨铜、铜-钼-铜(CMC)、铜-钼铜-铜(Cu/MoCu/Cu)和多层式铜一钼-铜(S-CMC)材料结合了钼、钨的低热膨胀率和铜的高热导率,可有效释放电子器件的热量,有助于冷却|GBT模块、RF功率放大器、LED芯片等各种产品,可用于大规模集成电路和大功率微波器件中作为金属基片、热控板、热沉材料和引线框架。

    我们可以按照客户要求提供以上各种材料的板材和成品。如果需要,也可以提供镀镍、金产品。

    Power electronics and circuits produce a lot of heat when they work. Heat sink materials help to eliminate chip heat, transferring it to other media and keeping the chip stable

Molybdenum copper, tungsten copper, and some sandwich materials such as CMC, Cu/Mocu/Cu,S-CMCcombined with low thermal expansion rate of molybdenum, tungsten and high thermal conductivity of can effectively release electronics heat and contribute cooling IGBT module, RF power amplifier, LED and other products. They are thus applied as metal substrate, thermal control, heat sink and the lead in large-scale integrated circuit and high power microwave devices .

We can offer Wcu, Mocu, CMC, Cu/Mocu/Cu and s-cmc finished and semi-finished products. And we can also provide these products coated with Ni or Niau as customers need

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