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 HX 2100/慧芯2100 (8寸IC点胶装片机)

    1、 System Capability

        XY Placement ：  ±25μm

        Theta Placement ：±1°

        UPH： 20K

2、Material handling Capability

   Die Size :           0.25mm to 5mm （10-200mil）

   Leadframe Size :    Length: 100mm to 270mm

                      Width:15mm to 0.8mm

                      Thickness: 0.1mm to 0.8mm

   Loading System:    Stack Loader & Magazine Handler

3、Bond Head

   Bond Force:        30-250g

   Bonding Method:    Epoxy

4、Dispensing System

   Dual Time-Pressure Dispensing

   Dispensing Controller: Musashi

5、Wafer Stage

   Wafer Size:          4-8inch

6、Facilities Required

   Voltage :            220 VAC

   Frequency:          50Hz

   Compressed Air:     Min.5bar

   Flow Rale:          250LPM@5bar

   Power Consumption: -1500W

7、Dimensions

   Weight:             800kg

   W×D×H:            2200×1500×1800mm

8、HX Series:

   Epoxy Die Attach Solution: