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YX 2000 Spec/悦芯2000（物联网传感器/摄像头模组微组装）

1.    System capability

  Xy Placement                  ±15 μm

  Angular Placement              ±0.3°

  UPH                          >0.3k    (big die size)

                                >0.7k    (small die size)

2.       Material Handing Capability

   Die Size                      1mm to 7mm

   Substrate Size                 Length: 100 mm to 270 mm

   Width                       up to 100 mm

   Loading System                Magazine Handler

3.       Bond Head

   Bond Force                    30 -250 g

   Bonding Method                Epoxy

4.       Dispensing System

   Dual Time-Pressure Dispensing     Musashi

5.       Wafer Stage

   Wafer Size                     4-8 inch (Option: 12 inch)

6.       Facilities Required

   Voltage                        220 VAC

   Frequency                      50 Hz

   Compressed  Air                Min. 5 bar

Flow Rate                       250 LPM @ 5 bar

Power Consumption               Max.1500W

7.        Dimensions

Wight                           800 Kg

W x D x H                        2200×1500×1800mm

8.        Enclosure

    Stainless Steel with FFU