ZX 1000/智芯1000(多功能SiP点胶装片机)
1、
System
Capability
XY Placement: ±5μm
Angular Placement: ±0.3°
2、
Material
Handling Capability
Die Size: 7mil×7mil-240mil×240mil
Max Substrate Size: 100mm×250mm×10mm
3、
Bond
Head
Num of Bond Head: Dual
Bond Force: 30×250g
4、
Work
Table
XY Table Travel: 260mm×120mm
Repeatability: ±0.50μm
5、
Wafer
Stage
XY Table Travel: 170mm×170mm
6、
Facilities
Required
Voltage: 220VAC
Frequency: 50Hz
Compressed Air: Min.5 bar
Flow rate: 250LPM@5 bar
Power Consumption: Max.1500W
7、
Dimensions
Weight: 800kg
W×D×H: 1800×1500×1800mm
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