HX 2200/慧芯 2200（更高性能的8寸IC点胶装片机）

1、  System Capability

XY Placement:        ±25μm

Angular Placement:    ±1°

UPH:                 22K

2、  Material Handling Capability

Die Size:             0.25mm to 5mm(10-200mil)

Leadframe Size:      Length:100mm to 300mm

                     Width: 15mm to 100mm

                     Thickness:0.1mm to 0.8mm

Loading System:      Stack Loader & Magazine Handler

3、  Bond Head

Bond Force:          30-250g

Bond Method:         Epoxy

4、  Dispensing System

Dual Time-Pressure Dispensing

Dispensing Controller:  Musashi

5、  Wafer Stage

Wafer Size:           4-8inch

6、  Facilities Required

Voltage:              220VAC

Frequency:           50Hz

Compressed Air:      Min.5bar

Flow Rate:           250LPM@5bar

Power Consumption:  -1500W

7、  Dimension

Weight:              800kg

W×D×H：           2200×1500×1800mm

8、  HX Series

Epoxy Die Attach Solution