HX 3100/慧芯 3100（12寸点胶装片机）

1、  System Capability

XY Placement:          ± 25μm

Angular Placement:      ±1°

UPH:                   18k

2、  Material Handling Capability

Die Size:                0.25mm to 5mm(10-200mil)

Leadframe Size:         Length:100mm to 300mm

                        Width:15mm to 100mm

                        Thickness:0.1mm to 0.8mm

Loading System:         Stack Loader & Magazine Handler

3、  Bond Head

Bond Force:             30-250g

Bonding Method:         Epoxy

4、  Dispensing System

Dual time-Pressure Dispensing

Dispensing Controller:     Musashi

5、  Wafer Stage

Wafer Size:              12inch

6、  Facliities Required

Voltage:                 220VAC

           Frequency:              50Hz

           Compressed Air:         Min.5bar

           Flower Rate:            250LPM @5 bar

           Power Consumption:     -1500W

7、  Dimensions:

Weight:                 2000kg

W×D×H:                2300×1500×1800mm

8、  HX Series

Epoxy Die Attach Solution: