HYBOND=s型EDB-141是一种半自动模接机，提供均匀的环氧树脂或银玻璃在各种可编程的分配模式，具有一致的材料厚度和的模具布局。EDB-141可以安装一个模座，用于存放华夫饼包装/果冻包装或松散的模具，也可以安装一个模具喷射器，用于存放晶圆上的模具。该分配系统可配备HYBOND=s微分配头，用于极低体积的环氧树脂分配。该机坚固耐用，适用于连续生产，适用于小批量生产和实验室应用。模具的拾取和放置都很容易的帮助下，双闭路电视摄像机和分裂屏幕监视器，其中包括一个双视觉目标系统。EDB-141是模块化的，可以进行修改以适应定制包。

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Model EDB-141 Specifications:

!          Dispense System:                                    Programmable pressure, time and suck-back (avoids drip) system.

!          Bond Line Accuracy:                              "0.5mil ("12,7Fm).

!          Temperature Control Range:                  Ambient.  Ambient to 250° C with optional heat stage.

!          Bondable Die Size Range:                      6x6 mils (152x152Fm) to 1x1in (25x25mm) standard.

!          Placement Accuracy:                              "1mil ("25,4Fm) standard.  Less when adding microscope option.

!          Dispense Materials:                                 Epoxy, conductive epoxy and silver glass.

!          Bond Head Movement:                          Motorized, rotational with fixed pickup and placement points.

!          Bond Actuation:                                     By opto-sensor at fixed height.  Cycle initiated by footswitch.

!          Z Travel/Vertical Bonding Window:     0.5in. (1,20cm)/0.125 to 0.500 in (0,31cm to 1,20cm).

!          Table Motion:                                         Motorized/programmable ± .78” (20mm) travel, standard.

!          Input Power Requirements:                    120 VAC 50/60Hz @ 10A max., for 240VAC requires 600-065.

!          Minimum Bench Space Required:          Height/width: 24in. (61cm), Depth: 22in. (56cm), without monitor.

!          Facilities Required (minimum):              Vacuum: 23in.Hg (584mmHg).  Air: 60psi (4,2Kg/cm5).  

!          Unit Weight/Shipping Weight:               75lbs (34Kg)/150lbs (68Kg).  Shipping weight will vary.

!          Approximate Units Per Hour (UPH):     90 - 240 depending on options, settings and mode of operation.

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