» Bondable Wire Diameters:

0.5 to 3.0 mils (12,7 to 76,2 µm)

» Bondable Ribbon Dimensions:

Up to 1 x 20 mils (25,4 x 510 µm) in wedge bonder mode.

» Bondable Wire / Ribbon Materials:

Gold (aluminum and gold coated copper for wedge bonder)

» Bond Head Movement:

Motorized (servo); activated by manipulator switches or footswitches

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